Characterisation of high thermal conductivity thin-film substrate systems and their interface thermal resistance

Finite Element Analysis of the 3ω Method for Characterising High Thermal Conductivity Ultra-Thin Film/Substrate System

“…Secondly, the metal-strip element, used in the 3ω method as a heater and a temperature sensor, is merely a fraction of a Celsius degree hotter than the surrounding material. Such low temperature difference makes less undesirable heat loss from the sample and thus increases measurement accuracy [1,17,18]. Thirdly, this method is applicable to in situ characterisation [1,17,18].…”

“…Thermal management of advanced thin-film/substrate systems plays an important role in their applications [1][2][3][4][5][6]. In comparison with that of bulk material, the thermal conductivity of a thin-film could be significantly different because of the size effect and microstructural difference [2,3,7].…”

“…However, characterising the thermal conductivity of a thin-film is challenging due to the fact that controlling the heat penetration depth in micro-/nano-scale is difficult [8]. Particularly, if the thermal conductivity of a thin-film is relatively high, the measurement becomes more challenging as the heat could penetrate into the specimen fast and deeply [1].…”

“…A few methods have been developed for characterising the thermal conductivity of thin-films, including time-domain thermoreflectance (TDTR) method [9], scanning thermal probes [10,11], coherent optical method [12,13], Raman spectroscopy [14][15][16], and the 3ω method [1,17,18]. The 3ω method has several unique advantages over the others.…”

“…The 3ω method has several unique advantages over the others. Firstly, this method is non-destructive and relatively cost-effective [1]. Secondly, the metal-strip element, used in the 3ω method as a heater and a temperature sensor, is merely a fraction of a Celsius degree hotter than the surrounding material.…”