2008
DOI: 10.1016/s1573-4331(08)00016-4
|View full text |Cite
|
Sign up to set email alerts
|

Chapter 16 Growth and Etching of Semiconductors

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
2
1

Citation Types

0
7
0

Year Published

2009
2009
2021
2021

Publication Types

Select...
5
2

Relationship

1
6

Authors

Journals

citations
Cited by 10 publications
(7 citation statements)
references
References 482 publications
0
7
0
Order By: Relevance
“…At the interface, silicide layer is known to be formed which plays a key role in overcoming the large lattice mismatch. On the top of the silicide interlayer, an epitaxial Cu film was grown in the layer-by-layer-like fashion [9,10].…”
Section: Introductionmentioning
confidence: 99%
“…At the interface, silicide layer is known to be formed which plays a key role in overcoming the large lattice mismatch. On the top of the silicide interlayer, an epitaxial Cu film was grown in the layer-by-layer-like fashion [9,10].…”
Section: Introductionmentioning
confidence: 99%
“…EUV lithography is considered to be essential to semiconductor manufacturing since it is able to produce a shorter wavelength that allows a greater quantity of electrical circuits to enter a chip [54]. Then, an important step is etching, which is utilized in microfabrication to chemically eradicate layers of a material from the surface of a wafer in order to create a pattern of that material on the substrate [55].…”
Section: Semiconductor Manufacturing Processmentioning
confidence: 99%
“…Different methods can be used for the preparation of the catalytic nanoparticles, including thermal evaporation, sputtering, colloidal solutions; nevertheless, the focus has to remain on the agglomeration of the nanoparticles because the dimension of the clusters strongly influences the diameter of the growing nanowire. Since the nanowire deposition is performed at elevated temperatures, even if the metal forms a thin layer covering the entire substrate, clusters will be formed due to the Ostwald ripening . When the nanowires have a uniform cross‐section along their entire length, the condensation happens mainly at the catalyst surface, and then it diffuses and segregates at the interface with the nanowire.…”
Section: Preparation Techniques and Growth Mechanismsmentioning
confidence: 99%
“…Since the nanowire deposition is performed at elevated temperatures, even if the metal forms a thin layer covering the entire substrate, clusters will be formed due to the Ostwald ripening. 34 When the nanowires have a uniform cross-section along their entire length, the condensation happens mainly at the catalyst surface, and then it diffuses and segregates at the interface with the nanowire. In this case, a uniform catalyst dimension on the substrate should result in a uniform nanowire diameter, if nanoparticles coalescence effect is negligible.…”
Section: Preparation Techniques and Growth Mechanismsmentioning
confidence: 99%