Changes in the Wettability of Microporous Copper Layers Prepared by Different Modes of Electrodeposition

Abstract

The architecture of microporous nanostructured copper was surface engineered by an improvised conventional electrodeposition technique enabled with a dynamic hydrogen template over a copper substrate. The dependency of the copper architecture on the electrochemical parameters, the current density, and the deposition time are studied in detail. Single-step electrodeposition resulted in the formation of a fragile microporous nanostructure over the bare copper substrate. Focusing on structural stability, a two-step electrodeposition was carried out to make the copper architecture competitive in an adverse environment. Due to the grain growth in two-step electrodeposition, the structural stability was visibly enhanced, and the microporous nanostructure remained intact. The interaction of the microporous nanostructure with water was evaluated by measuring the contact angle, exhibiting both superhydrophobicity and superhydrophilicity.

Morphology and Wettability of Microporous Copper Deposits Decorated with Silver and Graphene Oxide Nanoparticles

“…The microporous copper surfaces developed by two-step electrodeposition displayed superhydrophilicity due to the numerous micropores and interconnection. A detailed study on the changes in wettability of copper layers created by different electrodeposition modes was reported earlier [29], whereas in contrast the silver dendrites covered copper architecture showed hydrophobicity (Figs. 5a-c).…”

“…The stability of the deposit was enhanced by carrying out a two-step electrodeposition process followed by the one-step procedure [4,28]. The fortification was implemented by performing electrodeposition at a longer duration by supplying lower magnitude current density, and the procedure is followed according to an earlier study [29]. The changes brought to the surface morphology can be seen in the SEM images presented Table 1.…”

Silver dendrite decorated microporous copper structures for the enhancement of nucleate boiling heat transfer

“…1 (a), which comprises an anode, cathode, and electrolyte. Before preparing the copper-silver deposits, a dry microporous copper deposit was synthesized by two-step electrodeposition [11,23,25] over a polished copper substrate of dimensions 25mm diameter and 5mm thickness. Prior to the electrodeposition process, the sample was polished for uniform roughness by a 1000 grit size emery paper.…”

“…Their impact on the adhesion and porosity was studied at higher cathode polarization. The variation in the morphology due to the second step of the electrodeposition of copper was in detail, and the morphology displayed unique interaction with water [23]. Likewise, the graphene oxide nanoparticles were impregnated into the porous morphology of copper, and wettability was investigated elaborately by Johnsan R et al [24].…”

Pool Boiling Heat Transfer on a Micro‐Structured Copper Oxide Surface with Varying Wettability

“…Surface modifications is one of the profound ways to enhance CHF in pool boiling [42]. Surface modification aims to change the surface properties like wettability [30,36,37,46,48,75], porosity [4,39] etc. that influence CHF and BHTC.…”