Abstract:An aluminum-copper cover layer on implanted magnetic garnet causes a change in certain magnetic parameters, having a direct effect on the device parameters of a bubble memory chip. This change is NOT seen in nonimplanted garnet slices. After 2 h of annealing at 350 C in vacuum, there was a difference in bubble collapse field between the metal-covered garnet and the bare garnet. This difference in some cases was more than 10 Oe, and it was then simple to create a region depleted of bubbles surrounded by a regio… Show more
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