Changes in Entropy Semiconductor Electron Subsystem on Fusion

Regel, A. R.; Galzov, V. M.

doi:10.1007/978-1-4613-2513-0_23

Cited by 1 publication

(2 citation statements)

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“…The activation energy of diffusion (E diff ) is the barrier of the diffusion that was calculated by ΔE a = E TS − E IS , where the energies of the transition state (E TS ) and the initial state (E IS ) were obtained with ZPE corrections. 13,26 Theoretical simulations of the sintering processes were carried out in terms of the surface-mediated Ostwald ripening process using the Gibbs−Thompson (GT) model coupled with the modified bond additivity (MBA) model by considering the atom mobilities of the different metals on the surface: 29 = −…”

Section: ■ Results and Discussionmentioning

confidence: 99%

“…The adsorption energies of Ag or Cu atom on the surface depend on E Ag or Cu , E cellulous surface , and E atom/metal surface , which are the total energies for the isolated Ag or Cu atom, the isolated substrate (e.g., cellulose), and Ag or Cu atom adsorption on metal surfaces, respectively. The activation energy of diffusion ( E diff ) is the barrier of the diffusion that was calculated by Δ E a = E TS – E IS , where the energies of the transition state ( E TS ) and the initial state ( E IS ) were obtained with ZPE corrections. , Theoretical simulations of the sintering processes were carried out in terms of the surface-mediated Ostwald ripening process using the Gibbs–Thompson (GT) model coupled with the modified bond additivity (MBA) model by considering the atom mobilities of the different metals on the surface: where R is the radius of a nanoparticle, t is time, E tot is the total energy, k is the Boltzmann constant, T is temperature, γ is the surface free energy, and Ω is the atomic volume of the bulk metal. R* represents the critical nanoparticle size at which the size neither increases or decreases.…”

Section: Resultsmentioning

confidence: 99%

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Silver–Copper Alloy Nanoinks for Ambient Temperature Sintering

et al. 2022

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There is an increasing need to reduce the silver content in silver-based inks or pastes and achieve low-temperature sintering for scalable and low-cost production of printed wearable electronics. This need depends on the ability to control the metal composition and the surface properties of the nanoinks. Alloying silver with copper provides a pathway for meeting the need in terms of cost reduction, but little is known about the composition controllability and the low-temperature sintering capability. We report herein a scalable wet chemical synthesis of bimetallic silver–copper alloy nanoinks with room temperature sintering properties. The bimetallic alloy nanoparticles with a controllable composition can be formulated as stable nanoinks. The nanoinks printed on paper substrates are shown to sinter under room temperature. In addition to composition dependence, the results reveal an intriguing dependence of sintering on humidity above the printed nanoink films. These findings are assessed based on theoretical simulation of the sintering processes via surface-mediated sintering and interparticle necking mechanisms in terms of nanoscale adsorption, adhesion and diffusion, and surface free energies. Implications of the findings for room temperature fabrication of wearable sensors are also discussed.

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Section: ■ Results and Discussionmentioning

confidence: 99%