Change in microstructures and mechanical properties during deep wire drawing of copper

Hanazaki, Kenichi; Shigeiri, Naoto; Tsuji, Nobuhiro

doi:10.1016/j.msea.2010.05.057

Cited by 68 publications

(34 citation statements)

References 17 publications

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“…The UTS for the OFHC-Cu wires (ca. 450 MPa) are close to the value (460 MPa) reported [11] for a Cu wire deepdrawn at RT using a cylinder with a comparable grain size (9.4 μm), validating both our wire-drawing and UTS measurement processes [9]. For the present Cu wires, the UTS values are systematically higher (550 vs 450 MPa at 293 K and 700 vs 550 MPa at 77 K) than for the OFHC-Cu wires.…”

Section: −1supporting

confidence: 87%

“…We have reported [9] an innovative approach combining spark plasma sintering (SPS) and room-temperature (RT) wire-drawing to produce Cu wires with both a high ultimate tensile strength (UTS) and high electrical conductivity. The short sintering times used in SPS [10] permit to produce Cu cylinders (to be wire-drawn) with an ultra-fine microstructure, ten times smaller than for conventional cylinders [9,11]. Strengthening of the wires originates from the propagation of dislocations by an Orowan-type dislocation glide mechanism in grains smaller than 250 nm [9].…”

Section: T R a C Tmentioning

confidence: 99%

See 1 more Smart Citation

High strength-high conductivity carbon nanotube-copper wires with bimodal grain size distribution by spark plasma sintering and wire-drawing

et al. 2017

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Section: −1supporting

confidence: 87%

Section: T R a C Tmentioning

confidence: 99%

High strength-high conductivity carbon nanotube-copper wires with bimodal grain size distribution by spark plasma sintering and wire-drawing

et al. 2017

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“…The wire specimen processed by WD shows many dislocation substructures and LAGBs in the ultrafine grains. 11) In the case of annealing at various temperatures after WD, it was confirmed that the fraction of HAGBs and the grain size increased, and the recovery and recrystallization occurred inside the grains (as shown in Figs. 7 and 8).…”

Section: Plastic Instability Of Wire Specimensmentioning

confidence: 66%

Changes in Mechanical Characteristics of Pre-Annealed Wires of Cu–Sn Alloy Manufactured by Continuous Draw Bending

et al. 2012

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The changes in mechanical properties and microstructures of fine CuSn alloy wires manufactured by deep wire drawing and heat treatment, and of the wires deformed by draw bending were systematically investigated. During draw bending, the wires were subjected to the compressive/tensile or tensile/compressive strain in the longitudinal direction. As a result, it was confirmed that the softening caused by plastic deformation was induced when easing up the wire drawing strain by heat treatment were few, such as the decreasing strength and increasing elongation. Work hardening was induced when easing up the wire drawing strain by heat treatment were large, such as the increasing strength and decreasing elongation. With decreasing strength of softening induced by plastic deformation, increase in grain size is smaller than the strength deterioration. Additionally, it was confirmed that the occupancy probability of high-angle grain boundaries increases. This can be understood by considering that the many dislocations formed inside the grains are piled up in one direction during draw bending. Additionally, it is considered that ductility enhancement is caused by the increase in work hardening rate induced by the piled up dislocations.

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“…This is an indication of inhomogeneity with regard to mechanical properties across the transverse section. Further quantitative 02009-p. 4 ICNFT 2015 analysis, including grain size, local strain, and hardness measurements, will be conducted in the near future to further evaluate the proposed method for the prediction of grain deformation.…”

Section: Resultsmentioning

confidence: 99%

“…That study also demonstrated that yield strength, ultimate tensile stress, and hardness gradually increased with the number of ECAP passes. Moreover, the improvement in mechanical properties and the decrease in electrical conductivity occur in copper wire that has been deformed by the deep wire-drawing process [4], in which the copper underwent severe plastic deformation to form ultrafine microstructures. The angular accumulative drawing process is a recent development aimed a Corresponding author: ccchang@kuas.edu.tw at enhancing mechanical properties by using the change in strain path to introduce microstructure inhomogeneity at the cross-section of the wire [5].…”

Section: Introductionmentioning

confidence: 99%

Prediction of grain deformation in drawn copper wire

Chang

Wang

Huang

et al. 2015

MATEC Web of Conferences

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Abstract. Most copper wire is produced using a drawing process. The crystallographic texture of copper wire, which is strongly associated with grain deformation, can have a profound effect on the formability and mechanical and electrical properties. Thus, the ability to predict grain deformation in drawn copper wire could help to elucidate the evolution of microstructure, which could be highly valuable in product design. This study developed a novel method for predicting grain deformation in drawn copper wire based on finite element simulation with flow net analysis. Simple upsetting tests were conducted to obtain flow stress curves for the simulation of the drawing process. Predictions related to grain deformation were compared with those on the micrographs of the drawn copper wire obtained in experiments. In longitudinal and transverse cross-sections of the drawn wire, the predicted and experiment results presented similar trends involving considerable deformation within the grains. This preliminary study demonstrates the efficacy of the proposed method in providing information useful to the prediction of the grain deformation in drawn copper wire.

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Change in microstructures and mechanical properties during deep wire drawing of copper

Cited by 68 publications

References 17 publications

High strength-high conductivity carbon nanotube-copper wires with bimodal grain size distribution by spark plasma sintering and wire-drawing

High strength-high conductivity carbon nanotube-copper wires with bimodal grain size distribution by spark plasma sintering and wire-drawing

Changes in Mechanical Characteristics of Pre-Annealed Wires of Cu–Sn Alloy Manufactured by Continuous Draw Bending

Prediction of grain deformation in drawn copper wire

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Change in microstructures and mechanical properties during deep wire drawing of copper

Cited by 68 publications

References 17 publications

High strength-high conductivity carbon nanotube-copper wires with bimodal grain size distribution by spark plasma sintering and wire-drawing

High strength-high conductivity carbon nanotube-copper wires with bimodal grain size distribution by spark plasma sintering and wire-drawing

Changes in Mechanical Characteristics of Pre-Annealed Wires of Cu&ndash;Sn Alloy Manufactured by Continuous Draw Bending

Prediction of grain deformation in drawn copper wire

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Changes in Mechanical Characteristics of Pre-Annealed Wires of Cu–Sn Alloy Manufactured by Continuous Draw Bending