Change in electrical resistivity of some high polymers during isothermal polymerization

Aukward, J. A.; Warfield, R. W.; Petree, M. C.

doi:10.1002/pol.1958.1202711516

Cited by 37 publications

(5 citation statements)

References 5 publications

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“…(20), the ultimate heat of cure Qu has been used as the normalizing parameter for determining a,, whereas QT has been used as the normalizing parameter for determining (Y as is readily apparent from eq. (15). Both definitions for the degree of cure were found to yield accurate and consistent results.…”

Section: Kinetic Modelmentioning

confidence: 70%

Effect of fillers on kinetics of epoxy cure

Dutta

Ryan

1979

J of Applied Polymer Sci

140

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SynopsisThe effect of fillers on the reaction of liquid epoxy systems cured with rn-phenylenediamine has been studied within the temperature range 70-170°C using a Perkin-Elmer differential scanning calorimeter. Quantitative studies have been made with regard to the effect of fillers on the kinetics of cure. Mathematical expressions have been devised to describe the curing reaction as a function of time, temperature, and filler content. These kinetic expressions were found to yield results which were in gooa agreement with the experimental data for the two fillers studied.

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Section: Kinetic Modelmentioning

confidence: 70%

Effect of fillers on kinetics of epoxy cure

Dutta

Ryan

1979

J of Applied Polymer Sci

140

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“…Perhaps a torque method involving a continuously rotating cylinder and incorporating the newer solid-state strain gauges could be developed for use in following polymerization reactions. For high conversions (greater than about 10%), one can measure changes in the local or microscopic viscosity by means of the electrical conductivity of the system (13,65,334). Electrical conductivity of nonaqueous solutions presumably arises from the fortuitous presence of ions and decreases with increasing local viscosity.…”

Section: Survey Of Experimental Methodsmentioning

confidence: 99%

Photopolymerization of vinyl monomers

Oster¹,

Yang²

1968

Chem. Rev.

247

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“…The extent of polymerization greatly influences the physical, mechanical, and electrical characteristics of numerous polymers [6]. For instance, the curing information of the adhesive can be obtained by measuring the changes in direct current conductivity or resistivity during the curing process [4,[7][8][9][10]. Fisch found that the density of the adhesive decreases with an increase in curing temperature and degree [11].…”

Section: Introductionmentioning

confidence: 99%

Monitoring of the curing process and thermal failure of adhesive-bonded structures based on damping measurement using quantitative electromechanical impedance

Liu

Wang

Xie

et al. 2023

Smart Mater. Struct.

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Adhesives are essential materials in engineering and their strength directly affects the safety of structures. The curing and environmental deterioration are critical areas of focus in adhesive researches. However, conventional studies on adhesive curing emphasize only on the characteristics of the adhesive itself, while studies on deterioration of adhesive-bonded structure tend to concentrate on detecting disbonds. In this work, we proposed to monitor the curing process and thermal failure of adhesive-bonded-structures based on damping measurement using a quantitative electromechanical impedance (Q-EMI) method. The performances of two adhesives, i.e., epoxy and cyanoacrylate, were studied via bonding a piezoelectric transducer onto one end of an alumina bar and measuring the admittance spectrum of the transducer-adhesive-alumina system. Results show that the damping steadily decreases during the curing process and eventually stabilizes for both adhesive-bonded structures. A significantly higher curing rate is observed at 60℃ compared to that at room temperature. At high temperatures, the damping will increase dramatically, or no peaks can be observed in the admittance spectrum, indicating adhesive failure. The results indicate that the epoxy adhesive can function normally at temperatures up to 120℃ and can endure heating-cooling cycles up to 180℃, while the cyanoacrylate adhesive can function normally at 140℃ but fails upon cooling. The proposed Q-EMI method is quite powerful in monitoring the performances of bonded structures.

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Change in electrical resistivity of some high polymers during isothermal polymerization

Cited by 37 publications

References 5 publications

Effect of fillers on kinetics of epoxy cure

Effect of fillers on kinetics of epoxy cure

Photopolymerization of vinyl monomers

Monitoring of the curing process and thermal failure of adhesive-bonded structures based on damping measurement using quantitative electromechanical impedance

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