2018
DOI: 10.1115/1.4039974
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Challenges in Three-Dimensional Printing of High-Conductivity Copper

Abstract: With recent advancements in additive manufacturing (AM) technology, it is possible to deposit copper conductive paths and insulation layers of an electric machine in a selective controlled manner. AM of copper enables higher fill factors that improves the internal thermal conduction in the stator core of the electric machine (induction motor), which will enhance its efficiency and power density. This will reduce the motor size and weight and make it more suitable for aerospace and electric vehicle applications… Show more

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Cited by 39 publications
(40 citation statements)
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“…However, the poor absorptivity, lower ambient temperatures, and lack of a vacuum atmosphere may contribute to a significantly different outcome. In the work by El-Wardany et al [6], a relatively high oxygen copper powder was heat treated in a forming gas environment in order to remove the surface oxides and subsequently be coated with a polydimethylsiloxane (PDMS) polymer. No further data on the chemistry, properties, or microstructure of this material were reported, other than the observation of the formation of unexpectedly large pores in single track welds that were not present in the untreated powders.…”
Section: Discussionmentioning
confidence: 99%
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“…However, the poor absorptivity, lower ambient temperatures, and lack of a vacuum atmosphere may contribute to a significantly different outcome. In the work by El-Wardany et al [6], a relatively high oxygen copper powder was heat treated in a forming gas environment in order to remove the surface oxides and subsequently be coated with a polydimethylsiloxane (PDMS) polymer. No further data on the chemistry, properties, or microstructure of this material were reported, other than the observation of the formation of unexpectedly large pores in single track welds that were not present in the untreated powders.…”
Section: Discussionmentioning
confidence: 99%
“…Hydrogen, carbon monoxide, and ethanol are commonly employed reducing agents of Cu 2 O and CuO in thin films [31][32][33]. El-Wardany et al [6] treated copper powders for L-PBF in a heated forming gas atmosphere (4% H 2 + Ar bal. ), theorizing that the hydrogen would reduce the surface Cu 2 O films into Cu + H 2 O, however, no quantitative data on the composition of the powders or solid samples produced were provided [6].…”
Section: Introductionmentioning
confidence: 99%
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“…However, 3D printing of pure copper has several significant processing challenges that need to be addressed. Due to copper's high thermal conductivity, the melt area experiences rapid heat dissipation and high local thermal gradients, resulting in delamination, layer curling, and part failure [40,41]. Furthermore, the post-build powder removal and recovery of the printed parts might be impeded by the high ductility of copper while the tendency of powder agglomeration could lower overall flowability and hinder powder deposition.…”
Section: Introductionmentioning
confidence: 99%
“…However, defects in LPBF-built parts lead to a deterioration of the mechanical properties. In [27], parameter studies on oxygen-free, high-conductivity (OFHC) copper with small amount of phosphor (0.03-0.6 wt.%) were performed and samples reached relative densities of only 92% for laser sources of 300 W (1060 nm). For Cu-Cr-Zr-Ti alloys, a density of 97.9% was obtained [28], when using a laser source of 400 W. However, the porosity led to a reduction of the ultimate tensile strength of 20 to 25% compared to hot-rolled samples, which might be caused by residual porosity in the LPBF material [28].…”
Section: Introductionmentioning
confidence: 99%