Challenge to zero CTE and small cure shrinkage organic substrate core material for thin CSP package

Sakamoto, Norihiko; Takanezawa, Shin; Tsuchikawa, Satoru; Takekoshi, Masaaki; Oohashi, Kenichi; Morita, Koji

doi:10.1109/icep.2016.7486778

2016 International Conference on Electronics Packaging (ICEP) 2016

DOI: 10.1109/icep.2016.7486778

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Challenge to zero CTE and small cure shrinkage organic substrate core material for thin CSP package

Norihiko Sakamoto

Shin Takanezawa

Satoru Tsuchikawa

et al.

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Alkali-free aluminoborosilicate glass with high elastic modulus and low thermal expansion coefficient designed by structure gene modeling: Molecular dynamics simulations

Zhang,

Kang,

et al. 2025

Computational Materials Science

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Alkali-free aluminoborosilicate glass with high elastic modulus and low thermal expansion coefficient designed by structure gene modeling: Molecular dynamics simulations

Zhang,

Kang,

et al. 2025

Computational Materials Science

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Challenge to zero CTE and small cure shrinkage organic substrate core material for thin CSP package

Cited by 1 publication

References 2 publications

Alkali-free aluminoborosilicate glass with high elastic modulus and low thermal expansion coefficient designed by structure gene modeling: Molecular dynamics simulations

Alkali-free aluminoborosilicate glass with high elastic modulus and low thermal expansion coefficient designed by structure gene modeling: Molecular dynamics simulations

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