Abstract:Due to increasing computational workload and thermal design power requirements of high power-density microelectronics, low heat carrying capacity and poor thermal conductivity of air renders air-cooling insufficient to meet the cooling demands of component heat generation in high-performance servers. A more effective method of removing heat from these high-powered components is by using single-phase immersion cooling with a dielectric fluid of superior thermal properties and high boiling point. This study comp… Show more
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