CFD analysis of hotspots copper metal foam flat heat pipe for electronic cooling applications

Brahim, Taoufik; Jemni, Abdelmajid

doi:10.1016/j.ijthermalsci.2020.106583

Cited by 32 publications

(3 citation statements)

References 32 publications

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“…The publications include the paper or articles from books, reports, conference papers, and journals. As CFD simulation is associated with any fluid flow, this application is widely used in many different fields, which are aerodynamics [25], heating, ventilation and air conditioning (HVAC) [26], heat transfer [27], electronic cooling [28], pollutants simulation [29] and many more.…”

Section: Identification Phasementioning

confidence: 99%

Computational Fluid Dynamics of Wind Flow and Air Pollution Modelling: A Review on 3D Building Model Standards

Ridzuan

Ujang²,

Azri³

et al. 2022

IOP Conf. Ser.: Earth Environ. Sci.

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Computational Fluid Dynamics (CFD) simulations are used to monitor air pollution events supported by real-world conditions digitally. Besides, wind flow that has a close relationship with air pollutants dispersion also can be visualized by using CFD simulation. The presence of a building, especially in terms of the building’s geometry, impacts the air pollution dispersion and wind flow that occur around a building or in a specific research area. As there is an involvement of building models in the simulation, some of the standards for the building modelling: Computer-Aided Design (CAD), City Geographic Markup Language (CityGML), and Building Information Modelling (BIM), are being utilized in this type of study. Many types of research have been conducted to study the pollutants and wind flow using the CFD technique of these three standards. Hence, this review paper is used to presents several pieces of research on this related topic. Through this review paper, some of the drawbacks of the study were identified, such as the detailing of the building’s geometry and the compatibility of each standard to be implemented in the CFD simulation.

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Section: Identification Phasementioning

confidence: 99%

Computational Fluid Dynamics of Wind Flow and Air Pollution Modelling: A Review on 3D Building Model Standards

Ridzuan

Ujang²,

Azri³

et al. 2022

IOP Conf. Ser.: Earth Environ. Sci.

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“…These devices come under stress once the working temperature exceeds 85°C. 7 According to a United States Air Force survey, more than 55% of the total electronics failures are caused by heat-related issues. 8 The electronic device failure exponentially increases with an increase in the operating temperature.…”

Section: Introductionmentioning

confidence: 99%

Deployment of vapour chambers for electronic heat dissipation: state-of-the-art

Chitnis

Dayal

Arora

2022

Proceedings of the Institution of Mechanical Engineers, Part C:

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Miniaturization and high performance are the two principal requirements of modern electronics. All commercial applications demand reliable performance at high operational efficiency for prolonged service life. In order to meet all these requirements, the cooling system should be able to handle large heat fluxes packed in compact spaces and take away the heat as soon as possible to avoid overheating of the chip. Phase change heat transfer devices can handle large heat fluxes on account of latent heating. Lately, vapour chambers (VCs) are found to be promising heat spreaders as they are passive two-phase heat transfer devices. They effectively eliminate the hotspots, transferring high heat fluxes with better efficiencies and offer lower thermal resistance compared to the conventional cooling techniques. A detailed review of the latest research and advancements in the field of VCs is presented in this paper, including the effect of different thermo-physical parameters on their performance. Finally, all the major findings are summarized, including the future scope of development in a systematic manner.

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“…Metal foams have been widely researched for their excellent thermal transfer augmenting potential due to their extraordinary heat conducting properties, high surface area density and other desired properties such as high strength and low density. Applications where metal foams have been found to be advantageous include hotspot removal in electronic equipment [1,2] thermal energy storage [3,4], photo voltaic panel [5], thermal management in batteries [6,7], boiling heat transfer [8], solar collectors [9,10], etc. However, the benefit of augmented heat transfer with the use of metal foams in heat exchanging applications is always compromised by increased pressure drop due to high flow obstruction offered by such materials.…”

Section: Introductionmentioning

confidence: 99%

Various Trade-Off Scenarios in Thermo-Hydrodynamic Performance of Metal Foams Due to Variations in Their Thickness and Structural Conditions

Gnanasekaran

Mobedi

2021

Energies

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The long standing issue of increased heat transfer, always accompanied by increased pressure drop using metal foams, is addressed in the present work. Heat transfer and pressure drop, both of various magnitudes, can be observed in respect to various flow and heat transfer influencing aspects of considered metal foams. In this regard, for the first time, orderly varying pore density (characterized by visible pores per inch, i.e., PPI) and porosity (characterized by ratio of void volume to total volume) along with varied thickness are considered to comprehensively analyze variation in the trade-off scenario between flow resistance minimization and heat transfer augmentation behavior of metal foams with the help of numerical simulations and TOPSIS (Technique for Order of Preference by Similarity to Ideal Solution) which is a multi-criteria decision-making tool to address the considered multi-objective problem. A numerical domain of vertical channel is modelled with zone of metal foam porous media at the channel center by invoking LTNE and Darcy–Forchheimer models. Metal foams of four thickness ratios are considered (1, 0.75, 0.5 and 0.25), along with varied pore density (5, 10, 15, 20 and 25 PPI), each at various porosity conditions of 0.8, 0.85, 0.9 and 0.95 porosity. Numerically obtained pressure and temperature field data are critically analyzed for various trade-off scenarios exhibited under the abovementioned variable conditions. A type of metal foam based on its morphological (pore density and porosity) and configurational (thickness) aspects, which can participate in a desired trade-off scenario between flow resistance and heat transfer, is illustrated.

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CFD analysis of hotspots copper metal foam flat heat pipe for electronic cooling applications

Cited by 32 publications

References 32 publications

Computational Fluid Dynamics of Wind Flow and Air Pollution Modelling: A Review on 3D Building Model Standards

Computational Fluid Dynamics of Wind Flow and Air Pollution Modelling: A Review on 3D Building Model Standards

Deployment of vapour chambers for electronic heat dissipation: state-of-the-art

Various Trade-Off Scenarios in Thermo-Hydrodynamic Performance of Metal Foams Due to Variations in Their Thickness and Structural Conditions

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