Ceramic column grid array for flip chip applications

Master, R.N.; Cole, Marie; Martin, Gregory; Caron, A

doi:10.1109/ectc.1995.517801

Cited by 33 publications

(9 citation statements)

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“…Master [2] has reported the CCGA for flip-chip applications in a temperature range of 0 o C to +100 o C and -55 o C to +125 o C. In this study, it was demonstrated that the column height and temperature cycling conditions were in agreement with CoffinManson relationship. Aeroflex has tested 472 pin CCGA daisy chained package in a temperature range of -55 o C to +105 o C for 500 thermal cycles and observed fractures in solder joints at board side and some also showed higher resistance.…”

Section: Literature Reviewsupporting

confidence: 79%

Reliability assessment of ceramic column grid array (CCGA717) interconnect packages under extreme temperatures for space applications (-185°C to +125°C)

Ramesham

2010

SPIE Proceedings

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Ceramic Column Grid Array packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performance, compatibility with standard surface-mount packaging assembly processes, etc. CCGA packages are used in space applications such as in logics and microprocessor functions, telecommunications, flight avionics, payload electronics, etc. As these packages tend to have less solder joint strain relief than leaded packages, the reliability of CCGA packages is very important for short and long-term space missions.CCGA interconnect electronic package printed wiring boards (PWBs) of polyimide have been assembled, inspected non-destructively and subsequently subjected to extreme temperature thermal cycling to assess the reliability for future deep space, short and long-term, extreme temperature missions. In this investigation, the employed temperature range covers from -185 o Cto +125 o C extreme thermal environments. The test hardware consists of two CCGA717 packages with each package divided into four daisy-chained sections, for a total of eight daisy chains to be monitored. The CCGA717 package is 33 mm x 33 mm with a 27x27 array of 80%/20% Pb/Sn columns on a 1.27 mm pitch. The resistance of daisy-chained, CCGA interconnects were continuously monitored as a function of thermal cycling. Electrical resistance measurements as a function of thermal cycling are reported and the tests to date have shown significant change in daisy chain resistance as a function of thermal cycling. The change in interconnect resistance becomes more noticeable with increasing number of thermal cycles. This paper will describe the experimental test results of CCGA testing under wide extreme temperatures. Standard Weibull analysis tools were used to extract the Weibull parameters to understand the CCGA failures.Optical inspection results clearly indicate that the solder joints of columns with the board and the ceramic package have failed as a function of thermal cycling. The first failure was observed at 137 th thermal cycle and 63.2% failures of daisy chains have occurred at about 664 thermal cycles. The shape parameter extracted from Weibull plot was about 1.47 which indicates the failures were related to failures occurred during the flat region or useful life region of standard bath tub curve. Based on this experimental test data one can use the CCGAs for the temperature range studied for ~100 thermal cycles (ΔT = 310 o C, 5 o C/minute, and 15 minutes dwell) with high degree of confidence for high reliability space and other applications.

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Section: Literature Reviewsupporting

confidence: 79%

Reliability assessment of ceramic column grid array (CCGA717) interconnect packages under extreme temperatures for space applications (-185°C to +125°C)

Ramesham

2010

SPIE Proceedings

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“…Master [2] has reported the CCGA for flip-chip applications in a temperature range of 0 o C to +100 o C and -55 o C to +125 o C. In this study [2], it was demonstrated that the column height and temperature cycling conditions were in agreement with Coffin-Manson relationship. CCGA assembly and rework was described in depth in a user guide published by IBM [1] and also in [3 and 4].…”

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confidence: 76%

Reliability of high I/O high density CCGA interconnect electronic packages under extreme thermal environments

Ramesham

2012

SPIE Proceedings

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Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performances, compatibility with standard surfacemount packaging assembly processes, and so on. CCGA packages are used in space applications such as in logic and microprocessor functions, telecommunications, payload electronics, and flight avionics. As these packages tend to have less solder joint strain relief than leaded packages or more strain relief over lead-less chip carrier packages, the reliability of CCGA packages is very important for short-term and long-term deep space missions.We have employed high density CCGA 1152 and 1272 daisy chained electronic packages in this preliminary reliability study. Each package is divided into several daisy-chained sections. The physical dimensions of CCGA1152 package is 35 mm x 35 mm with a 34 x 34 array of columns with a 1 mm pitch. The dimension of the CCGA1272 package is 37.5 mm x 37.5 mm with a 36 x 36 array with a 1 mm pitch. The columns are made up of 80% Pb/20%Sn material.CCGA interconnect electronic package printed wiring polyimide boards have been assembled and inspected using non-destructive x-ray imaging techniques. The assembled CCGA boards were subjected to extreme temperature thermal atmospheric cycling to assess their reliability for future deep space missions. The resistance of daisy-chained interconnect sections were monitored continuously during thermal cycling.This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions.

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“…CCGA, a very important member of the BGA family, has become more and more popular because of its excellent performances, such as in heat dissipation, moisture resistance, high temperature resistance, high pressure resistance, high reliability, etc. [1].…”

Section: Introductionmentioning

confidence: 95%

Coupling effects of mechanical vibrations and thermal cycling on reliability of CCGA solder joints

Ding¹,

Tian

Wang³

et al. 2015

Microelectronics Reliability

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Ceramic column grid array for flip chip applications

Cited by 33 publications

References 0 publications

Reliability assessment of ceramic column grid array (CCGA717) interconnect packages under extreme temperatures for space applications (-185°C to +125°C)

Reliability assessment of ceramic column grid array (CCGA717) interconnect packages under extreme temperatures for space applications (-185°C to +125°C)

Reliability of high I/O high density CCGA interconnect electronic packages under extreme thermal environments

Coupling effects of mechanical vibrations and thermal cycling on reliability of CCGA solder joints

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