Cationic UV cure kinetics for multifunctional epoxies

Boey, Freddy; Rath, Santosh Kumar; Ng, Annie; Abadie, M. J. M.

doi:10.1002/app.11041

Cited by 43 publications

(26 citation statements)

References 7 publications

(2 reference statements)

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“…12(b,c)]. The concentration of TMPTMA has no apparent influence on the alternating-current resistivity values of the resulting IPNs in the frequency range from 10 À2 to 10 6 Hz. These phenomena may be attributed to the crosslinking structures of the cured epoxides with and without the modifier TMPTMA and the species and numbers of free carriers in these cured epoxides systems.…”

Section: Alternating-current Resistivity Measurementmentioning

confidence: 95%

Morphology and thermal and dielectric behavior of cycloaliphatic epoxy/trimethacrylate interpenetrating polymer networks for vacuum‐pressure‐impregnation electrical insulation

Duan

Kim

Zheng

et al. 2008

J of Applied Polymer Sci

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Vacuum pressure impregnation has been known as the most advanced impregnation technology that has ever been developed for large and medium highvoltage electric machines and apparatuses. We developed one new type of vacuum-pressure-impregnation resin with excellent properties by means of a novel approach based on in situ sequential interpenetrating polymer networks resulting from the curing of trimethacrylate monomer [trimethylol-1,1,1-propane trimethacrylate (TMPTMA)] and cycloaliphatic epoxy resin (CER). In this study, the influence of the concentrations of the components and their microstructures on their thermal and dielectric behaviors were investigated for the cured CER/TMPTMA systems via atomic force microscopy, dynamic mechanical analysis, thermogravimetric analysis, and dielectric analysis. The investigation results show that the addition of TMPTMA to the CER-anhydride system resulted in the formation of a uniform and compact microstructure in the cured epoxy system. This led the cured CER/TMPTMA systems to show much higher moduli in comparison with the pure CER-anhydride system. The thermogravimetric analysis results show that there existed a decreasing tendency in the maximum thermal decomposition rates of the cured CER/TMPTMA systems, which implies that the thermal stability properties improved to some extent. The dielectric analysis results show that the cured CER/TMPTMA systems displayed quite different dielectric behaviors in the wide frequency range 0.01 Hz-1 MHz and in the wide temperature range 27-250 C compared with the cured CER-anhydride system.

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Section: Alternating-current Resistivity Measurementmentioning

confidence: 95%

Morphology and thermal and dielectric behavior of cycloaliphatic epoxy/trimethacrylate interpenetrating polymer networks for vacuum‐pressure‐impregnation electrical insulation

Duan

Kim

Zheng

et al. 2008

J of Applied Polymer Sci

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“…[45] Since SU-8 is transparent in the near-UV and visible regions of the electromagnetic spectrum but highly opaque in the deep-UV region, the use of thick films of SU-8 photoresist in lithographic technologies utilizing < 350 nm light has been hampered by the absorbance of the resist itself.…”

Section: Feature Articlementioning

confidence: 99%

3D Micro‐ and Nanostructures via Interference Lithography

Jang

Ullal

Maldovan

et al. 2007

Adv Funct Materials

202

170

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Interference lithography (IL) holds the promise of fabricating large‐area, defect‐free 3D structures on the submicrometer scale both rapidly and cheaply. A stationary spatial variation of intensity is created by the interference of two or more beams of light. The pattern that emerges out of the intensity distribution is transferred to a light sensitive medium, such as a photoresist, and after development yields a 3D bicontinuous photoresist/air structure. Importantly, by a proper choice of beam parameters one can control the geometrical elements and volume fraction of the structures. This article provides an overview of the fabrication of 3D structures via IL (e.g., the formation of interference patterns, their dependence on beam parameters and several requirements for the photoresist) and highlights some of our recent efforts in the applications of these 3D structures in photonic crystals, phononic crystals and as microframes, and for the synthesis of highly non spherical polymer particles. Our discussion concludes with perspectives on the future directions in which this technique could be pursued.

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“…Photochemically induced cationic polymerization has been shown to be applicable to the high functionality epoxy-based negative photoresist material -SU8, which has been widely used in photolithographic fabrication of micro-electromechanical systems (MEMS) [19,20].…”

Section: Results Obtained and Discussionmentioning

confidence: 99%

UV curing kinetic of high performance epoxy resin for Roll-to-Roll UV embossing

Voytekunas

Shan

et al. 2010

2010 12th Electronics Packaging Technology Conference

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In present work curing kinetics of UV-initiated cationic photo-polymerization of EPICLON series epoxy resin HP-820 and key cure process parameters, such as the extent of crosslinking and conversion, polymerization rate and the order of reactions have been studied by Photo-Differential Scanning Calorimetry (DPC). Different kinetics analysis results, including enthalpy of the reaction, induction time, peak maximum, percentage conversion were obtained for studied epoxy system at different isothermal temperatures (30-70 o C), allowing calculating activation energy. Two kinetic parameters -coefficient rate (k) and the order of the initiating reaction (m) were determined, using an autocatalytic kinetics model. IntroductionThe extensive development of the UV curing technology has opened the way to numerous end uses, more recently -in nonconventional micro-patterning technique -in a continuous Roll-to-Roll (R2R) UV embossing, which can provide a solution for high speed large area nano-and microscale patterning of different structures with greatly improved throughput [1-6]. One of the examples is microlens array (MLA) film, which among various application found in the field of optical sensors and communications, displays, lighting devices etc can be an effective solution in enhancing the light and increasing optical coupling efficiency [7].Among polymer-based lens materials having been extensively studied since 1990s, UV curable has been shown to be the most attractive not only from environmental point of view, introducing solvent free formulations and ambient temperature operations but also due to the high polymerization speed of resins, resulting in reduced cost of final product [2]. Tailor made properties -is another great advantage of materials, produced by UV induced polymerization [3].The market of photocurable resins is very large and diversified. Among two major classes of UV-curable resins available on the market and often used in various UV-assisted patterning processes and techniques -multifunctional acrylates, and multifunctional epoxides, the last ones present number of advantages. First of all, epoxies are cured via cationic, oxygen inhibition free curing mechanism, allowing avoiding special environmental conditions needed for acrylates, cured via radical mechanism [8]. More of that, its lower, compare, to acrylate resins shrinkage after curing allows more faithful pattern application. However, despite these advantages their market is still small, and one of the reason, beside the price is probably related to their lower than acrylate`s and methacrylate`s reactivity.

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Cationic UV cure kinetics for multifunctional epoxies

Cited by 43 publications

References 7 publications

Morphology and thermal and dielectric behavior of cycloaliphatic epoxy/trimethacrylate interpenetrating polymer networks for vacuum‐pressure‐impregnation electrical insulation

Morphology and thermal and dielectric behavior of cycloaliphatic epoxy/trimethacrylate interpenetrating polymer networks for vacuum‐pressure‐impregnation electrical insulation

3D Micro‐ and Nanostructures via Interference Lithography

UV curing kinetic of high performance epoxy resin for Roll-to-Roll UV embossing

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