“…Previous research also showed the soft nature of ZnO, [8][9][10] which significantly affects the wafer handling, processing, and manufacture of ZnO-based devices. Polishing induced damage has been investigated by cathodoluminescence (CL), [9][10][11][12][13][14][15] photoluminescence (PL), 16,17 ion channeling, 18 positron annihilation spectroscopy (PAS), 19 and deep level transient spectroscopy (DLTS). 20 Both CL and PL research on ZnO demonstrated that mechanical polishing leads to surface and near surface damage, which decreases near band edge (NBE) luminescence efficiency, and forms non-radiative recombination centers (NRRCs) and intrinsic defects such as zinc vacancy (V Zn ) and zinc interstitial (Zn i ).…”