Casting Blanks Cleanliness Evaluation Based on Ultrasonic Microscopy and Morphological Filtering

Abstract

The cleanliness of the casting blanks could seriously affect the quality of downstream products. Recently, ultrasound technology has been introduced to detect the inclusions in metal materials. However, due to the anisotropy of the material crystal, the ultrasonic wave has the characteristics of multiple scattering and refraction in its propagation process. This makes it difficult to evaluate the casting blanks cleanliness effectively, for the inclusion echoes are submerged in the background noise. Therefore, the ultrasonic microscope is innovatively proposed to carry out efficient scanning on the casting blanks. In the meantime, the morphological filtering algorithm has the advantages of fewer parameters and faster calculation speed which can be used to increase the signal-to-noise ratio of ultrasound images and extract the defect features more efficiently. In order to verify the effectiveness of the proposed method, specimens were taken from three strands of continuous caster for detection and analysis. The experimental results show that the second strand has the best quality and the cleanliness is 2.2/mm3, which is obviously better than the other two strands. This method will provide a new technology for the quantitative evaluation of the internal quality of the casting blanks.

Effects of Deformation Penetration and Recrystallization on the Internal Quality of Casting Ingot

“…Ultrasonic scanning technology can be used for characterization of larger scale internal defects (greater than 100 μm) such as internal segregation, inclusions, and voids. [ 24,25 ] Xiao et al [ 26 ] utilized ultrasonic scanning technology to perform 3D reconstruction of internal segregation. With the help of ultrasonic nondestructive testing technology, this article analyzes the influence of the reduction pass in the HTRP process and discusses the effect of recrystallization on defect healing through the combination of scanning electron microscope (SEM) and finite element simulation.…”