Case study on the validation of SAC305 and SnCu-based solders in SMT, wave and hand-soldering at the contract assembler level

Biocca, Peter; Rivas, Carlos

doi:10.1109/isapm.2007.4419935

Cited by 6 publications

(3 citation statements)

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“…Trends within the microelectronics assembly industry are toward lower energy costs and minimizing the impact on human health and the environment. Since the implementation of the Directive on the Restriction of Hazardous Substances (RoHS) and Waste Electrical and Electronic Equipment (WEEE), 1,2 the traditional Sn37Pb (materials in this paper are expressed as weight percent unless specified otherwise) solder has largely been substituted with lead-free solders such as Sn3.0Ag0.5Cu (SAC305) with a liquidus temperature of 220 °C. 3 However, as microelectronic devices become smaller and more condensed, the electronics with temperature-sensitive components and substrates can be damaged during the soldering process.…”

Section: ■ Introductionmentioning

confidence: 99%

In Situ Observation of the Ga- and Cu-Based Substrate Reaction by Synchrotron Microradiography

Hao,

Tan,

Liu

et al. 2023

ACS Appl. Electron. Mater.

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Section: ■ Introductionmentioning

confidence: 99%

In Situ Observation of the Ga- and Cu-Based Substrate Reaction by Synchrotron Microradiography

Hao,

Tan,

Liu

et al. 2023

ACS Appl. Electron. Mater.

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“…After the bar stops, the bar remains pressurized until the solder cools, crystallizes, and solidifies, thus achieving solder welding of the workpiece. Compared with traditional hand-soldering [1]- [3], HBS has several advantages, such as simple operation, simultaneous welding of multiple solder joints, good welding consistency, excellent welding quality, and easy automation. It is widely used for solder welding of printed circuit boards, flexible circuit boards, tinned flat copper wires, and coaxial cables [2], [4]- [8].…”

Section: Introductionmentioning

confidence: 99%

Effect of Servo-Pressurized Mode on Soldering Process Characteristics of Micro-Parts

Zhang

Yang

et al. 2022

IEEE Access

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To solve the problems of high pressure fluctuations and uncontrollable process pressure in the traditional pneumatic pressurized hot-bar solder welding process, a servo-pressurized system with high dynamic pressure and displacement responses was designed during this study using a servo motor. Focusing on the connection requirements between narrow-gap coaxial cables and printed circuit boards, the overall scheme of the system was designed, the dynamic characteristics of the mechanical structure of the system were analyzed, the hardware and software design processes for the control system were described, and a stage-type pressure-following motion control scheme for the hot bar suitable for solder-forming control was proposed. By conducting solder welding tests on narrow-gap coaxial cables with and without the control scheme, the welding process characteristics and joint qualities after welding were analyzed. The results show that when using the control scheme for solder welding, the welding pressure changes during the solder welding process trended first from a rapid increase to a slow decrease, then to a rapid decrease, to a slow decrease, and finally to a near zero value. "Soft contact" pressurization between the hot bar and the welded workpieces was achieved, the pressure fluctuations were reduced, and better surface and higher strengths were obtained for the welded joints.INDEX TERMS Hot-bar soldering, servo-pressurized system, stage-type pressure-following, solder welding, process characteristics analysis.

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“…It allows electrical current to flow from one point to another and become a supporter of the electrical components. Recently, lead free, tin, silver and copper (Sn-Ag-Cu) solder alloy has been commercially used as an alternative to tin and lead (Sn-Pb) solder due to the vital issue on hazardous effect [1][2][3][4]. This is due to poisonous qualities of lead which are harmful to human health and also to the environment [5].…”

Section: Introduction mentioning

confidence: 99%

The Effect of Electrochemical Migration of Pb-free Sn-3.0Ag-0.5Cu Solder Reinforced by NiO Nanoparticles

Omar¹,

Salleh²,

Othman³

et al. 2018

JMSE-A

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As electronic devices continue to become lighter and thinner, they require much smaller solder joints and fine-pitch interconnections for microelectronic packaging. Pb-free solders incorporated with nano-sized particles have been identified as potential Pb-free nanocomposite solders that could provide higher microstructure stability and better mechanical properties than the conventional solders. The present study investigates the effects of NiO addition on the mechanical properties and microstructure of the Sn-3.0Ag-0.5Cu (SAC305) solder alloy. In this study, three different solder alloys were prepared by reflow soldering. Sn-3.0Ag-0.5Cu (SAC 305) solder alloys were doped with different percentage of NiO (nickel oxide) nanoparticles content; i.e. 0.01 wt%, 0.05 wt%, and 0.15 wt% in producing nanocomposite solder paste. Morphology refinement of SAC305-NiO nanocomposite solder contributed to the enhancement of mechanical properties in the field of microelectronic industries. ECM (electrochemical migration) of SAC-NiO nanocomposites solder pastes was measured using a WDT (water drop test). Effects of electrochemical migration of its surface morphology were investigated using OM (optical microscopy).

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Case study on the validation of SAC305 and SnCu-based solders in SMT, wave and hand-soldering at the contract assembler level

Cited by 6 publications

References 0 publications

In Situ Observation of the Ga- and Cu-Based Substrate Reaction by Synchrotron Microradiography

In Situ Observation of the Ga- and Cu-Based Substrate Reaction by Synchrotron Microradiography

Effect of Servo-Pressurized Mode on Soldering Process Characteristics of Micro-Parts

The Effect of Electrochemical Migration of Pb-free Sn-3.0Ag-0.5Cu Solder Reinforced by NiO Nanoparticles

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