2022
DOI: 10.1016/j.ceramint.2021.12.186
|View full text |Cite
|
Sign up to set email alerts
|

Carbothermal synthesis of high-aspect-ratio AlN whiskers using graphite felt as carbon source

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1

Citation Types

1
3
0

Year Published

2022
2022
2024
2024

Publication Types

Select...
8

Relationship

4
4

Authors

Journals

citations
Cited by 8 publications
(4 citation statements)
references
References 25 publications
1
3
0
Order By: Relevance
“…Figure 11A shows the scanning results of XPS measurement in the range of 0–1200‐eV binding energy, and the elements of Al, N, C, and O can be detected. Due to the extremely easy oxidation of the AlN surface, the presence of oxygen element was inevitable in the AlN powders, which is consistent with the previous report 33,34 . The data of Mn 2p corresponding binding energy is shown in Figure 11B.…”
Section: Resultssupporting
confidence: 90%
See 1 more Smart Citation
“…Figure 11A shows the scanning results of XPS measurement in the range of 0–1200‐eV binding energy, and the elements of Al, N, C, and O can be detected. Due to the extremely easy oxidation of the AlN surface, the presence of oxygen element was inevitable in the AlN powders, which is consistent with the previous report 33,34 . The data of Mn 2p corresponding binding energy is shown in Figure 11B.…”
Section: Resultssupporting
confidence: 90%
“…Due to the extremely easy oxidation of the AlN surface, the presence of oxygen element was inevitable in the AlN powders, which is consistent with the previous report. 33,34 The data of Mn 2p corresponding binding energy is shown in Figure 11B. The peak at 640.6 eV belongs to Mn 2p 3/2 , with a satellite peak at 647.5 eV, whereas the peak at 653.9 eV is caused by Mn 2p 1/2 .…”
Section: Effects Of Mn 2+ Concentrationmentioning
confidence: 99%
“…With the continuous progress of electronic technology, chips and electronic devices are moving toward the direction of miniaturization and high power density, which brings a powerful use of functions, but also leads to serious heat dissipation problems [1][2][3]. If the heat generated by the chip cannot be eliminated in time, it will seriously affect the performance, reliability, and service life of electronic devices.…”
Section: Introductionmentioning
confidence: 99%
“…In order to achieve this aim, two main strategies have been reported. The first one is to promote the directional arrangement of fillers to build an orderly thermal conductive network using several special methods, such as hot pressing [13][14][15], casting molding [16], ice-template [17][18][19][20], vacuum filtration [21][22][23], electrospinning [24][25][26], etc. Among them, the ice-template method is extremely suitable for the preparation of the TIMs, which benefits from its low processing shrinkage, controllable porosity and superior mechanical strength.…”
Section: Introductionmentioning
confidence: 99%