Carborane-Containing Aromatic Polyimide Films with Ultrahigh Thermo-Oxidative Stability

Liu, Fulin; Fang, Guangqiang; Shen, Yang; Zhang, Xuezhong; Zhang, Zhijie

doi:10.3390/polym11121930

Cited by 13 publications

(9 citation statements)

References 44 publications

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“…19 Therefore, from the initial stage of curing, the proportion of signals (192.3 eV) representing the broken cage structure is also increasing. With the curing reaction, there is also the oxidation process of boron (B-O 193.4 eV), 20 as shown in Fig. 2b and c.…”

Section: Mechanism Of Carborane Monomer Promoting Cyano Curingmentioning

confidence: 95%

A new approach to enhance the performance of phthalonitrile: study of carborane curing agents with dual functions

Ding,

Zong,

Wang

et al. 2023

Mol. Syst. Des. Eng.

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Section: Mechanism Of Carborane Monomer Promoting Cyano Curingmentioning

confidence: 95%

A new approach to enhance the performance of phthalonitrile: study of carborane curing agents with dual functions

Ding,

Zong,

Wang

et al. 2023

Mol. Syst. Des. Eng.

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“…F. L. Liu et al developed carborane-containing aromatic polyimide (CPI) films, with extraordinary thermo-oxidative stability at 700 °C, formed by casting poly(amic acid) (PAA) resin solution on a glass substrate and then thermal imidizing at high temperatures [ 66 ]. In an aprotic solvent, an aromatic dianhydride and a mixture of aromatic diamines, including carborane-containing aromatic diamine, were copolymerized to produce the PAA solution.…”

Section: Aromatic Polyimide Filmsmentioning

confidence: 99%

Progress in Aromatic Polyimide Films for Electronic Applications: Preparation, Structure and Properties

Yang

et al. 2022

Polymers

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Aromatic polyimides have excellent thermal stability, mechanical strength and toughness, high electric insulating properties, low dielectric constants and dissipation factors, and high radiation and wear resistance, among other properties, and can be processed into a variety of materials, including films, fibers, carbon fiber composites, engineering plastics, foams, porous membranes, coatings, etc. Aromatic polyimide materials have found widespread use in a variety of high-tech domains, including electric insulating, microelectronics and optoelectronics, aerospace and aviation industries, and so on, due to their superior combination characteristics and variable processability. In recent years, there have been many publications on aromatic polyimide materials, including several books available to readers. In this review, the representative progress in aromatic polyimide films for electronic applications, especially in our laboratory, will be described.

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“…Some studies have increased the heat resistance of fibers by introducing inorganic particles. For example, Liu et al prepared PI films with carborane to enhance their heat resistance. At a carborane loading of 50 mol %, the T 10% of the sample was determined to be 657 °C in a nitrogen atmosphere.…”

Section: Introductionmentioning

confidence: 99%

Preparation of High-Temperature Resistant Polyimide Fibers by Introducing the p-Phenylenediamine into Kapton-Type Polyimide

Dong,

et al. 2024

ACS Appl. Polym. Mater.

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To improve the heat resistance of polyimide (PI) fibers for application in harsh environments and establish a correlation among the chemical structure, fabrication performance, and material properties, a simple and rigid diamine, p-phenylenediamine (p-PDA) was incorporated into the Kapton-type PI synthesized from pyromellitic dianhydride and 4,4-diaminodiphenylmethane (ODA). The comprehensive properties of these co-PI fibers were systematically investigated to assess the impact of p-PDA addition. Two-dimensional wide-angle X-ray diffraction (WAXD) was used to investigate the evolution of the aggregation structure of the co-PI fibers during the processing. The thermogravimetric analyzer (TGA) test shows that the incorporation of p-PDA improves the heat resistance of polyimide fibers, with the 10 wt % weight loss temperature (T 10% ) ranging from 582 to 605 °C and the maximum decomposition temperature (T max ) of 611−635 °C for the co-PI fibers with different p-PDA contents. Additionally, the potential degradation mechanism of the PI fibers was examined by utilizing pyrolysis-gas chromatography/mass spectrometry (Py-GC/MS) and other thermal analyses. By introducing p-PDA, the content of O element (ether bond in ODA) in the system decreases, leading to a reduction in oxygen free radicals from ODA during the decomposition process of polyimides. The decrease in active species can cause a decrease in the decomposition rate and improve the heat resistance of the polyimide fibers. The study of the thermal decomposition mechanism of polyimides provides a valuable foundation for the preparation of high-performance polymer fibers with enhanced thermal resistance and excellent overall performance.

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Carborane-Containing Aromatic Polyimide Films with Ultrahigh Thermo-Oxidative Stability

Cited by 13 publications

References 44 publications

A new approach to enhance the performance of phthalonitrile: study of carborane curing agents with dual functions

A new approach to enhance the performance of phthalonitrile: study of carborane curing agents with dual functions

Progress in Aromatic Polyimide Films for Electronic Applications: Preparation, Structure and Properties

Preparation of High-Temperature Resistant Polyimide Fibers by Introducing the p-Phenylenediamine into Kapton-Type Polyimide

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