2011
DOI: 10.1117/2.1201012.003220
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Carbon nanotubes for next-generation interconnects

Abstract: Multi-walled carbon nanotubes and single-walled carbon-nanotube bundles can replace copper interconnection wires in very-large-scale integration circuits.

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Cited by 3 publications
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“…These constraints stem from the physical restraint of copper interconnect, making it essential to look at alternate interconnect materials for future ICs. The two promising candidates for Copper interconnects are Optical and Carbon Nanotube (CNT) interconnects [2,3].Though the performance of Optical interconnect (OI) is more effective for both off-chip and on-chip applications because of its wide bandwidth, less signal attenuation and relatively low power dissipation while compared to Copper interconnect, an optical waveguide is a relatively larger in size making it difficult to scale its pitch below 0.6µm [4].…”
Section: Introductionmentioning
confidence: 99%
“…These constraints stem from the physical restraint of copper interconnect, making it essential to look at alternate interconnect materials for future ICs. The two promising candidates for Copper interconnects are Optical and Carbon Nanotube (CNT) interconnects [2,3].Though the performance of Optical interconnect (OI) is more effective for both off-chip and on-chip applications because of its wide bandwidth, less signal attenuation and relatively low power dissipation while compared to Copper interconnect, an optical waveguide is a relatively larger in size making it difficult to scale its pitch below 0.6µm [4].…”
Section: Introductionmentioning
confidence: 99%