Carbon Nanotube Thermal Pastes for Improving Thermal Contacts

Xu, Yunsheng; Leong, Chia-Ken; Chung, D.D.L.

doi:10.1007/s11664-007-0188-3

Cited by 46 publications

(20 citation statements)

References 53 publications

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“…Carbon nanotubes (CNTs) have gained a significant amount of research interest for use in thermal management applications due to exceptionally high values of the intrinsic thermal conductivity of individual CNTs, k, reported in experiments [2][3][4][5][6][7][8][9] and computational studies . Specific examples of the use of CNTs to enhance the efficiency of heat sinks or heat dissipation to the surrounding environment include the efficient cooling of silicon chips by CNT microfin structures [31], the use of CNT bumps in highfrequency, high-power, flip-chip amplifiers [32], and the design of CNT-based thermal interface materials (TIMs) [33][34][35][36][37][38][39][40][41][42][43].…”

Section: Introductionmentioning

confidence: 99%

Thermal conductance of carbon nanotube contacts: Molecular dynamics simulations and general description of the contact conductance

Salaway

Zhigilei

2016

Phys. Rev. B

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The contact conductance of carbon nanotube (CNT) junctions is the key factor that controls the collective heat transfer through CNT networks or CNT-based materials. An improved understanding of the dependence of the inter-tube conductance on the contact structure and local environment is needed for predictive computational modeling or theoretical description of the effective thermal conductivity of CNT materials. To investigate the effect of local structure on the thermal conductance across CNT-CNT contact regions, non-equilibrium molecular dynamics (MD) simulations are performed for different inter-tube contact configurations (parallel fully or partially overlapping CNTs and CNTs crossing each other at different angles) and local structural environments characteristic of CNT network materials. The results of MD simulations predict a stronger CNT length dependence present over a broader range of lengths than has been previously reported and suggest that the effect of neighboring junctions on the conductance of CNT-CNT junctions is weak and only present when the CNTs that make up the junctions are within the range of direct van der Waals interaction with each other. A detailed analysis of the results obtained for a diverse range of inter-tube contact configurations reveals a non-linear dependence of the conductance on the contact area (or number of interatomic inter-tube interactions) and suggests larger contributions to the conductance from areas of the contact where the density of interatomic inter-tube interactions is smaller. An empirical relation accounting for these observations and expressing the conductance of an arbitrary contact configuration through the total number of interatomic inter-tube interactions and the average number of interatomic inter-tube interactions per atom in the contact region is proposed. The empirical relation is found to provide a good quantitative description of the contact conductance for various CNT configurations investigated in the MD simulations and is suitable for incorporation into mesoscopic models capable of predicting the effective thermal transport properties of CNT materials.

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Section: Introductionmentioning

confidence: 99%

Thermal conductance of carbon nanotube contacts: Molecular dynamics simulations and general description of the contact conductance

Salaway

Zhigilei

2016

Phys. Rev. B

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“…[5][6][7][8][9][10][11][12][13][14][15][16][17][18][19] A thermal paste comprises a base medium (i.e., the vehicle, which is a liquid) and one or more suspended solid components that includes one that is thermally conductive. Since thermal conductivity has long been assumed in the thermal interface material industry to be the key criterion in determining the effectiveness of a thermal interface material, conventional solid components include various metal and ceramic particles that exhibit high thermal conductivity.…”

Section: Introductionmentioning

confidence: 99%

“…High spreadability results in a small bond line thickness. The conformability and spreadability have recently been shown by Chung et al [9][10][11][12][13][14][15][16][17] to be so important that solid components that are not very conductive (e.g., carbon black) can outperform those that are much more conductive (e.g., silver). Nanostructuring helps both conformability and spreadability.…”

Section: Introductionmentioning

confidence: 99%

Nanoclay Paste as a Thermal Interface Material for Smooth Surfaces

Lin

Chung

2008

Journal of Elec Materi

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A paste in the form of a polyol ester vehicle (liquid) containing 0.6 vol.% nanoclay is an effective thermal interface material. Nanoclay with a high conformability and hence a small bond line thickness is preferred, namely montmorillonite containing a quarternary ammonium salt organic modifier (dimethyl dehydrogenated tallow) at 125 meq/100 g clay, after exfoliation by using the vehicle. When it is used between smooth (0.009 lm) copper surfaces at a pressure of 0.69 MPa, the thermal contact conductance reaches 40 9 10 4 W/m 2 K, in contrast to the corresponding values of 28 9 10 4 W/m 2 K, 28 9 10 4 W/m 2 K, 25 9 10 4 W/m 2 K, and 24 9 10 4 W/m 2 K previously reported for carbon black, fumed alumina, fumed zinc oxide, and graphite nanoplatelet pastes. Between rough copper surfaces (12 lm), the conductance provided by the nanoclay paste is slightly below those of the other pastes. The superiority of the nanoclay paste for smooth surfaces is attributed to the submicron bond line thickness; the inferiority for rough surfaces is due to the low thermal conductivity. The conductance provided by the nanoclay paste increases from 31 9 10 4 W/m 2 K to 40 9 10 4 W/m 2 K when the pressure is increased from 0.46 MPa to 0.92 MPa. This pressure dependence is stronger than that of any of the other pastes studied.

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“…Nanotubes are also used to synthesize nanofluids which find applications in cooling and thermal storage technologies. Nanotubes have, therefore, been proposed for applications as nanofins to cool high heat flux electronic devices and as highly conducting thermal interface materials between microprocessor chips and heat sinks (Kordas et al 2007;Xu et al 2006Xu et al , 2007.…”

Section: Properties and Applications Of Carbon Nanotubesmentioning

confidence: 99%

Nanofins: Science

Singh¹,

Banerjee²

2013

Nanofins

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This chapter provides background information on carbon nanotubes (CNT), molecular dynamics (MD) simulations, and interfacial thermal resistance (R k ). The first section discusses carbon nanotubes, their structure, properties, and potential applications. The second section introduces the molecular dynamics simulations. This section discusses the basic equations describing the motion of the atoms, the force field to calculate potential energy of the system, boundary conditions, and ensembles employed in this work and space-time correlation to calculate the properties of the system. The last two sections detail the interfacial thermal resistance, theories developed to calculate interfacial resistance, importance of interfacial resistance at nanoscales, and the simulation techniques developed and used in calculating the interfacial thermal resistance.

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Carbon Nanotube Thermal Pastes for Improving Thermal Contacts

Cited by 46 publications

References 53 publications

Thermal conductance of carbon nanotube contacts: Molecular dynamics simulations and general description of the contact conductance

Thermal conductance of carbon nanotube contacts: Molecular dynamics simulations and general description of the contact conductance

Nanoclay Paste as a Thermal Interface Material for Smooth Surfaces

Nanofins: Science

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