2020
DOI: 10.2139/ssrn.3539255
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Carbon Bonding Controls the Electron and Phonon Thermal Conductivity in High Entropy Carbides

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Cited by 2 publications
(3 citation statements)
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“…In particular, 4-point bending strengths increased by 40% to 60%, while fracture toughness improved by about 20%. [62,63,66]. Reducing the carbon content of films increased the metallic bonding, raising the electronic contribution to the thermal conductivity [62].…”
Section: Disorder-enhanced Propertiesmentioning
confidence: 99%
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“…In particular, 4-point bending strengths increased by 40% to 60%, while fracture toughness improved by about 20%. [62,63,66]. Reducing the carbon content of films increased the metallic bonding, raising the electronic contribution to the thermal conductivity [62].…”
Section: Disorder-enhanced Propertiesmentioning
confidence: 99%
“…[62,63,66]. Reducing the carbon content of films increased the metallic bonding, raising the electronic contribution to the thermal conductivity [62]. Very low thermal conductivities were reported for multicomponent chalcogenides [27,28] -promising for thermoelectric applications.…”
Section: Disorder-enhanced Propertiesmentioning
confidence: 99%
“…22,49 A fundamental feature of HEMs is the presence of a significant lattice distortion that effectively scatters heat-carrying phonons, leading to reduced lattice thermal conductivity. 44,[50][51][52] In parallel, the stabilization of single-phase structures through increased entropy weakens the electron scattering at phase boundaries in multiphase HEMs. This entropy-driven structural stabilization has a favorable effect on enhancing electrical transport properties.…”
Section: Introductionmentioning
confidence: 99%