Capillary forces as a limiting factor for sawing of ultrathin silicon wafers by diamond multi-wire saw

Ryningen, Birgit; Tetlie, Pål; Johnsen, Sverre Gullikstad; Dalaker, Halvor

doi:10.1016/j.jestch.2020.02.008

Cited by 5 publications

(2 citation statements)

References 21 publications

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“…Compared with a traditional inner circle slicer, the multi-wire sawing machine has high efficiency, high capacity, and high precision for slicing semiconductor materials and is the most widely used wafer sawing technology at present [2,3]. With the rapid development of the photovoltaic and semiconductor industries, the existing sawing efficiency does not meet the production needs of enterprises; to improve the sawing speed and efficiency of the material, it is necessary to improve its alignment speed, so that it will be able to withstand high speeds [4,5]. Increasing the alignment speed can reduce the sawing time, material consumption, production costs, etc., but with the increasing speed of the alignment the operational stability requirements are also increasingly high [6,7].…”

Section: Introductionmentioning

confidence: 99%

Research on High-Speed Vibration and Structure Optimization of Multiwire Sawing Machine

Dong,

Liang,

Chang

et al. 2023

Applied Sciences

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To improve the sawing stability and slicing quality of an existing multi-wire saw under severe vibrations using a high wire speed, its structure is optimized to improve its structural stiffness, so that it can still maintain good operation stability under higher wire speed. First, a finite element simulation model is established based on the shape, structural and material characteristics of the multi-wire saw, and then a transient dynamic simulation calculation is carried out using finite element software to obtain the vibration characteristics of the machine, which is verified with the measured data. The results show that the error between the calculated and the measured value is less than 11.46%, which verifies the accuracy of the simulation. On this basis, a multi-objective optimization design method based on the response surface is used to optimize the structure of the whole machine, and the optimized model is simulated again to evaluate its optimization effect. The results show that the amplitude of the optimized machine at a 2400 m/min wire speed is equivalent to that of the original machine at a 1500 m/min wire speed, and the wire speed is increased by 60% year-on-year with the same operation stability, which can guide research on high-speed multi-wire saws and machine tool vibration control strategies.

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Section: Introductionmentioning

confidence: 99%

Research on High-Speed Vibration and Structure Optimization of Multiwire Sawing Machine

Dong,

Liang,

Chang

et al. 2023

Applied Sciences

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“…However, with the rapid development of intelligent equipment, the wafer industry is demanding better surface and subsurface quality, and higher processing efficiency. Meanwhile, thinner and larger diameter wafers will be a trend in the future [4,5]. Therefore, some new methods that combined conventional MWS have been applied to the manufacturing of silicon wafers.…”

Section: Introductionmentioning

confidence: 99%

Experimental Study on Surface Integrity of Solar Cell Silicon Wafers Sliced by Electrochemical Multi-Wire Saw

Bao

Huang

et al. 2022

Micromachines

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Electrochemical multi-wire sawing (EMWS) is a hybrid machining method based on a traditional multi-wire sawing (MWS) system. In this new method, a silicon ingot is connected to a positive electrode; the slicing wire is connected to a negative electrode. Material is removed by the interaction of mechanical grinding and an electrochemical reaction. In this paper, contrast experiments of EMWS and MWS were conducted based on industrialized equipment to verify the beneficial effects of the hybrid method. The experimental statistical results show that the composite processing method improved the processing qualification rate by 1.28%, and the Bow of silicon wafers was reduced by about 2.74 microns. Further testing on the surface of the silicon wafer after electrochemical action showed that obvious holes were present on the surface, and the surface hardness of the wafer decreased significantly. Therefore, the scratches on the surface of wafer sliced by EMWS were reduced; in addition, the thickness of the surface damage layer was reduced by about 9 microns. After standard texturing, the average reflectivity of the wafers sliced by EMWS was about 2–10% lower than that of the wafers sliced by MWS in the wavelength of 300–1100 nm. In this paper, the voltage parameter of the composite machining is set to 48 V; the amount of electrolyte added in each experiment is 2 L; and a good machining effect is obtained. In the future, the electric parameters and cutting fluid components will be further studied to improve the electrochemical effect.

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A comprehensive review of diamond wire sawing process for single-crystal hard and brittle materials

Sefene,

Chen,

Tsai

2024

Journal of Manufacturing Processes

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Capillary forces as a limiting factor for sawing of ultrathin silicon wafers by diamond multi-wire saw

Cited by 5 publications

References 21 publications

Research on High-Speed Vibration and Structure Optimization of Multiwire Sawing Machine

Research on High-Speed Vibration and Structure Optimization of Multiwire Sawing Machine

Experimental Study on Surface Integrity of Solar Cell Silicon Wafers Sliced by Electrochemical Multi-Wire Saw

A comprehensive review of diamond wire sawing process for single-crystal hard and brittle materials

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