Cantilever Gold Ribbon Bonding used in MMCM

Zhi-jun, Han; Le, Jie; Yan, Wei; Yongfang, Hu; Li, Xiaoxuan

doi:10.1109/icept.2018.8480830

Cited by 2 publications

(3 citation statements)

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“…To solve this reliability problem, the coaxial seal and the substrate are usually connected by flexible structures such as wires and strips [13,14]. The interconnection modes mainly include core wire winding soldering [15], gold-ribbon lap bonding [16] and goldribbon wrap bonding [17].…”

Section: Directly Soldering Structurementioning

confidence: 99%

“…Gold-ribbon lap bonding is the use of a gold ribbon to form a "Z" shape along the transmission line, and the use of parallel gap-bonding equipment to complete the connection of pads at both ends [16,18]. The "Z" shaped gold ribbon is usually used for the interconnection of a non-coplanar coaxial seal to plane, such as the connection between the coaxial inner core and the side of substrate, as shown in Figure 4.…”

Section: Gold-ribbon Lap Bondingmentioning

confidence: 99%

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Space-Borne System-in-Package Based on High Reliability Microwave Interconnections

Wan

et al. 2023

Electronics

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With the increasing demand for multi-function and highly integrated space-borne microwave products, a three-dimensional heterogeneous integration based on special substrates and other systems-in-package has difficulty with meeting the requirements of high reliability in space. Through simulation, the thermal-deformation resistance of traditional interconnections meets the requirements of high reliability, but its transmission performance at high frequency is poor. Based on the above, a novel microwave horizontal coaxial transition structure with good thermal-deformation resistance and excellent microwave characteristics is proposed. The design formula of the structure is derived, and the basic size of the structure can be quickly calculated. The transition structure and a vertical matching structure can realize microwave interconnection by combining microstrip impedance transformation and gold-ribbon interconnection. The complex microwave circuit is laid out and partitioned in a three-dimensional way, and thus a space-borne microwave metallic system-in-package method based on high reliability microwave interconnections is implemented. A Ka-band receiving system-in-package is used as an example to carry out the actual test and validation. The better characteristics of the Ka-band receiving channel on the satellite are obtained, and its excellent reliability is verified by the temperature cycle and mechanical vibration test.

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Section: Directly Soldering Structurementioning

confidence: 99%

Section: Gold-ribbon Lap Bondingmentioning

confidence: 99%

Space-Borne System-in-Package Based on High Reliability Microwave Interconnections

Wan

et al. 2023

Electronics

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“…They are mostly implemented on less expensive and low-loss thin-film alumina ceramic substrates [ 9 ]. However, active devices or elements are connected to the circuits separately with wire or ribbon bonds since they are not formed in or on the substrate [ 10 , 11 , 12 , 13 ].…”

Section: Introductionmentioning

confidence: 99%

Tolerance Considerations for MHMIC Manufacturing Process at Millimeter-Wave Band

Hannachi,

Egels,

Pannier

et al. 2024

Sensors

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This paper investigates the manufacturing uncertainties at a 60 GHz millimeter-wave band for the monolithic hybrid microwave integrated circuits (MHMIC) fabrication process. It specifically deals with the implementation tolerances of thin-film gold microstrip transmission lines, titanium oxide thin-layer resistors, microstrip quarter-wavelength radial stubs, and active device implementation using the gold-bonding ribbons. The impacts of these manufacturing tolerances are assessed and experimentally quantified through prototyped MHMIC circuits. This allows us, on one hand, to identify the acceptable amount of dimensional variation enabling reasonable performances. On the other hand, it aims to establish a relationship between the manufacturing tolerances and the circuit parameters to provide more flexibility for the tolerance compensation and accuracy enhancement of the MHMIC fabrication processes.

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Cantilever Gold Ribbon Bonding used in MMCM

Cited by 2 publications

References 1 publication

Space-Borne System-in-Package Based on High Reliability Microwave Interconnections

Space-Borne System-in-Package Based on High Reliability Microwave Interconnections

Tolerance Considerations for MHMIC Manufacturing Process at Millimeter-Wave Band

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