Can nanoindentation help to determine the local mechanical properties of microelectronic materials? a state-of-the-art review

Albrecht, H.; Hannach, T.; Hase, Akira; Juritza, A.; Muller, K.; Müller, Wolfgang

doi:10.1109/eptc.2004.1396652

Cited by 3 publications

(3 citation statements)

References 10 publications

(1 reference statement)

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“…Nanoscale characterization techniques are continuously challenged by the rapid progress in nanostructures and functional materials demanding higher resolutions and advanced measurement techniques for mechanical, chemical, electrical, and thermal characterization. This understanding will be valuable in supporting the impetus to harness multifunctionality of materials to realize nano-and micro-devices [10]. Nanoindentation is widely used to study the displacement of materials under specific applied loads to produce load-displacement curves.…”

Section: State Of the Art / Related Literaturementioning

confidence: 99%

Mechanical Characterization of Ink-Jet Printed Ag Samples on Different Substrates

Vasiljević

Menićanin

Živanov

2013

IFIP Advances in Information and Communication Technology

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Abstract. In this paper, the main activity was to investigate how different substrates, temperature of sintering and percentage of silver ink containing silver nanoparticles influence on Young's modulus and hardness of printed silver thin samples. Samples were prepared by low cost ink-jet printing technique using Dimatix Material Printer on polyimide flexible substrate and slide glass. Characterization of these samples was carried out by Nano Indenter using a three sided pyramidal (Berkovich) diamond tip. Measurement results show that the thickness of ink-jet printed silver layer varies for different percent of nanoparticles in silver ink. All measurements were done at same depth of indentation to avoid possibility of perforation of printed layer. The higher temperature of sintering and the higher percent of silver nanoparticles give the bigger Young's modulus and hardness of printed silver sample. This research provides very useful information about mechanical characterization of the silver layers on flexible substrates for printed-electronics.

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Section: State Of the Art / Related Literaturementioning

confidence: 99%

Mechanical Characterization of Ink-Jet Printed Ag Samples on Different Substrates

Vasiljević

Menićanin

Živanov

2013

IFIP Advances in Information and Communication Technology

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“…Obviously the stress at the crack tip is reduced below the threshold needed for further IMC fracture crack growth. Based on [13,14] the fracture stress of IMC layers is at about 170 MPa. Since the IMC is not explicitly modeled, the solder stress at the crack tip was taken as result criteria.…”

Section: Investigation Of Imc Crack Length Effectmentioning

confidence: 99%

A detailed investigation of the failure formation of copper trace cracks during drop tests

Kraemer

Wiese

Rzepka

et al. 2010

3rd Electronics System Integration Technology Conference ESTC

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The development cycle of new products can be dramatically reduced if exact lifetime models are at hand. This requires the precise knowledge of the failure modes and the failure position under all test and service conditions. In case of dynamic mechanical loads like drops of BGA modules, broken copper traces at the PCB side are more and more often observed to be the ultimate failure effect. However, straightforward FEM simulations have shown unrealistic high stress and strain results not matching experimental observations which prove that a realistic representation of this failure is not trivial. A comprehensive physical investigation of the failure formation combined dye and pry tests, electron backscatter diffraction EBSD and 3-D X-ray tomography analyses. The results revealed the complex nature of the dynamic failure propagation. In addition to the ultimate fracture of the copper trace cracking of the IMC on top of the PCB pad was detected. Both failure modes are initiated during the drop event at different times and propagate with different speeds. Both failures are mutually interacting with each other with no single mode alone dominating the failure evolution. Hence, lifetime modeling needs to account for both failure modes in order to capture the copper trace stress realistically. Numerical simulations have been conducted investigating the experimental findings. A small flaw already reduces the stress level at the pad/solder interface substantially. The IMC crack is found to be initiated first reaching a stable length at the half pad diameter. In this condition, the copper trace is stressed at a lower level accumulating plastic strain enough to ultimately create the trace fracture in a realistic number of cycles. A very realistic 2nd level interconnection model has been created based on the combined failure mechanism found by comprehensive physical failure analysis, and the numerical simulations. It now allows lifetime prediction of BGA assemblies under drop test conditions with high accuracy and reliably. Hence, it will be able to replace expensive experiments by fast numerical assessments in the design optimization phase of product and technology development

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“…The structural or load-bearing application of lead-free solder is known to impose failures that are related to changes in strain rates (Lang et al, 2005;Pang, 2008;Plumbridge and Gagg, 1999;Suh et al, 2007). In addition, different shapes, sizes and methods of solder fabrication also play a role in changing solder performance (Albrecht et al, 2004;Shohji et al, 2008). Therefore, gaining knowledge on the effects of load bearing and strain rates can aid in assessing the mechanical performance of lead-free solder.…”

Section: Introductionmentioning

confidence: 99%

Deformation behaviour of Sn-3.0Ag-0.5Cu (SAC305) solder wire under varied tensile strain rates

Abdullah

Zulkifli

Jalar³

et al. 2017

SSMT

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Purpose The purpose of this paper is to investigate the relationship between microstructure and varied strain rates towards the mechanical properties and deformation behaviour of Sn-3.0Ag-0.5Cu (SAC305) lead-free solder wire at room temperature. Design/methodology/approach Tensile tests with different strain rates of 1.5 × 10−6, 1.5 × 10−5, 1.5 × 10−4, 1.5 × 10−3, 1.5 × 10−2 and 1.5 × 10−1 s−1 at room temperature of 25°C were carried out on lead-free Sn-3.0Ag-0.5Cu (SAC305) solder wire. Stress-strain curves and mechanical properties such as yield strength, ultimate tensile strength and elongation were determined from the tensile tests. A microstructure analysis was performed by measuring the average grain size and the aspect ratio of the grains. Findings It was observed that higher strain rates showed pronounced dynamic recrystallization on the stress-strain curve. The increase in the strain rates also decreased the grain size of the SAC305 solder wire. It was found that higher strain rates had a pronounced effect on changing the deformation or shape of the grain in a longitudinal direction. An increase in the strain rates increased the tensile strength and ductility of the SAC solder wire. The primary deformation mechanism for strain rates below 1.5 × 10−1 s−1 was grain boundary sliding, whereas the deformation mechanism for strain rates of 1.5 × 10−1 s−1 was diffusional creep. Originality/value Most of the studies regarding the deformation behaviour of lead-free solder usually consider the effect of the elevated temperature. For the current analysis, the effect of the temperature is kept constant at room temperature to analyze the deformation of lead-free solder wire solely because of changes of strain rates, and this is the originality of this paper.

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Can nanoindentation help to determine the local mechanical properties of microelectronic materials? a state-of-the-art review

Cited by 3 publications

References 10 publications

Mechanical Characterization of Ink-Jet Printed Ag Samples on Different Substrates

Mechanical Characterization of Ink-Jet Printed Ag Samples on Different Substrates

A detailed investigation of the failure formation of copper trace cracks during drop tests

Deformation behaviour of Sn-3.0Ag-0.5Cu (SAC305) solder wire under varied tensile strain rates

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