Calorific properties of liquid copper

Chekhovskoi, V. Ya.; Tarasov, V. D.; Gusev, Yu. V.

doi:10.1007/bf02755998

Cited by 23 publications

(9 citation statements)

References 3 publications

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“…It is assumed that the energy dissipated in the ignition wire is responsible for temperature increase and melting and evaporation of the wire. Time and voltage peak corresponding to ignition wire evaporation are estimated using the temperature dependent resistivity and specific heat of copper from literature [15]- [18]. The estimation of voltage peak corresponding to ignition fits well with the experimental results.…”

Section: E Effect Of Metal Vaporsupporting

confidence: 55%

Arc Voltage Characteristics in Ultrahigh-Pressure Nitrogen Including Supercritical Region

Abid

Niayesh

Jönsson

et al. 2018

IEEE Trans. Plasma Sci.

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Section: E Effect Of Metal Vaporsupporting

confidence: 55%

Arc Voltage Characteristics in Ultrahigh-Pressure Nitrogen Including Supercritical Region

Abid

Niayesh

Jönsson

et al. 2018

IEEE Trans. Plasma Sci.

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“…Comparison of the DFT results to the experimental melting temperature of 1358 K [66] leads us to an interesting conclusion. Neither one of the functionals performs better: PBE underestimates by −107 K and LDA overestimates by 136 K. Thus, the experimental value resides in between the two functionals, by coincidence quite close to the middle of the interval.…”

Section: Figure 6 Andmentioning

confidence: 74%

Efficient approach to compute melting properties fully from ab initio with application to Cu

2017

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Applying thermodynamic integration within an ab initio-based free-energy approach is a state-of-the-art method to calculate melting points of materials. However, the high computational cost and the reliance on a good reference system for calculating the liquid free energy have so far hindered a general application. To overcome these challenges, we propose the two-optimized references thermodynamic integration using Langevin dynamics (TOR-TILD) method in this work by extending the two-stage upsampled thermodynamic integration using Langevin dynamics (TU-TILD) method, which has been originally developed to obtain anharmonic free energies of solids, to the calculation of liquid free energies. The core idea of TOR-TILD is to fit two empirical potentials to the energies from density functional theory based molecular dynamics runs for the solid and the liquid phase and to use these potentials as reference systems for thermodynamic integration. Because the empirical potentials closely reproduce the ab initio system in the relevant part of the phase space the convergence of the thermodynamic integration is very rapid. Therefore, the proposed approach improves significantly the computational efficiency while preserving the required accuracy. As a test case, we apply TOR-TILD to fcc Cu computing not only the melting point but various other melting properties, such as the entropy and enthalpy of fusion and the volume change upon melting. The generalized gradient approximation (GGA) with the Perdew-Burke-Ernzerhof (PBE) exchange-correlation functional and the local-density approximation (LDA) are used. Using both functionals gives a reliable ab initio confidence interval for the melting point, the enthalpy of fusion, and entropy of fusion.

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“…The operation of the facility was checked by measuring C p of copper [6] and stainless steel [7] in the temperature range from 300 to 900 K. The difference between the obtained results and the most accurate literature data was approximately 1%. Table 1 and Fig.…”

Section: Heat Capacitymentioning

confidence: 97%

“…A detailed description of the procedure of measuring C p and of the distinguishing features of the experimental setup was given in [6]. The operation of the facility was checked by measuring C p of copper [6] and stainless steel [7] in the temperature range from 300 to 900 K. The difference between the obtained results and the most accurate literature data was approximately 1%.…”

Section: Heat Capacitymentioning

confidence: 99%

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The thermophysical properties of KhN55VMTKYu nickel-based heat-resistant alloy

Chekhovskoi¹,

Pelet︠s︡kiĭ²

2005

High Temp

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New experimental data are given for the KhN55VMTKYu industrial nickel-based heat-resistant alloy on its heat capacity at temperatures from 300 to 1000 K and on the thermal conductivity coefficient at T = 380-1450 K. The newly obtained and previously available data are used to construct approximating equations and tables of smoothed values in the range from 300 to 1200 K for heat capacity, enthalpy, average heat capacity, thermal conductivity, average coefficient of thermal expansion, density, and thermal diffusivity of the alloy. The effect of disordering of the Ni 3 (Ti, Al) intermetallic compound on the properties of the alloy is examined. The activation energy of disordering of the alloy Q = 0.93 eV and the temperature dependence of the enthalpy of disordering are estimated, as well as the concentration of intermetallic compound in the alloy.

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Calorific properties of liquid copper

Cited by 23 publications

References 3 publications

Arc Voltage Characteristics in Ultrahigh-Pressure Nitrogen Including Supercritical Region

Arc Voltage Characteristics in Ultrahigh-Pressure Nitrogen Including Supercritical Region

Efficient approach to compute melting properties fully from ab initio with application to Cu

The thermophysical properties of KhN55VMTKYu nickel-based heat-resistant alloy

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