Calibration scheme for a new type of 3D Hall sensor

Wouters, C.; Vranković, V.; Chevtsov, P.; Hierold, Christofer

doi:10.1016/j.sna.2017.02.007

Cited by 4 publications

(2 citation statements)

References 8 publications

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“…Generally, CMOS Hall sensors adopt integrated horizontal Hall plates as sensing devices, which are capable of detecting the magnetic field component orthogonal to the device surface [5−6] . However, in many applications such as tracking systems in MRI surgery tools [7] or position measurement in automobiles, there is a growing demand for the detection of three-dimensional (3D) magnetic field components [8,9] . Therefore, the vertical Hall devices (VHDs), which are sensitive to the magnetic field components parallel to the device surface are needed and technical solutions have been proposed to achieve this request [10] .…”

Section: Introductionmentioning

confidence: 99%

An integrated front-end vertical hall magnetic sensor fabricated in 0.18 μm low-voltage CMOS technology

Shu¹,

Jiang²,

Hu³

et al. 2022

J. Semicond.

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An integrated front-end vertical CMOS Hall magnetic sensor is proposed for the in-plane magnetic field measurement. To improve the magnetic sensitivity and to obtain low offset, a fully symmetric vertical Hall device (FSVHD) has been optimized with a minimum size design. A new four-phase spinning current modulation associated with a correlated double sampling (CDS) demodulation technique has been further applied to compensate for the offset and also to provide a linear Hall output voltage. The vertical Hall sensor chip has been manufactured in a 0.18 μm low-voltage CMOS technology and it occupies an area of 1.54 mm2. The experimental results show in the magnetic field range from –200 to 200 mT, the entire vertical Hall sensor performs with the linearity of 99.9% and the system magnetic sensitivity of 1.22 V/T and the residual offset of 60 μT. Meanwhile, it consumes 4.5 mW at a 3.3 V supply voltage. The proposed vertical Hall sensor is very suitable for the low-cost system-on-chip (SOC) implementation of 2D or 3D magnetic microsystems.

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Section: Introductionmentioning

confidence: 99%

An integrated front-end vertical hall magnetic sensor fabricated in 0.18 μm low-voltage CMOS technology

Shu¹,

Jiang²,

Hu³

et al. 2022

J. Semicond.

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show abstract

“…The calibration of the multi-axes measurement by Hall sensor is another critical issue, because the cross-sensitivity among the measurement axes would limit the accuracy of the measurement system. To solve this problem, Wouters [ 8 ] presented a calibration scheme for a 3D Hall sensor. A three DOF and four DOF displacement measurement system has been proposed [ 9 , 10 ].…”

Section: Introductionmentioning

confidence: 99%

Six Degrees of Freedom Displacement Measurement System for Wafer Stage Composed of Hall Sensors

Zhao

Shi

Zhang

et al. 2018

Sensors

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This paper proposes a decoupled six degrees of freedom (DOF) displacement measurement methodology, which is accomplished by utilizing six pairs of permanent magnets and six Hall sensors. Firstly, the coordinate transformation was mathematically derived, which represented the relationships between the main coordinate system of the motion system and each body coordinate system of the Hall sensors. With the aid of an ellipsoid function and the least squares method, only the output voltages of the six Hall sensors were required to decouple the six-DOF displacement and inclination of the motion platform with high accuracy. Finally, the experimental measurements demonstrate the effectiveness of the six DOF displacement measurement methodology, based on which the maximum errors of displacements can reach 0.23 mm and the maximum errors of inclinations can reach 0.07°.

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A reconfigurable miniaturized transducer based on rotating coils for testing particle accelerator magnets

Severino

Arpaïa

Espósito³

2018

Nuclear Instruments and Methods in Physics Research Section A:

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Calibration scheme for a new type of 3D Hall sensor

Cited by 4 publications

References 8 publications

An integrated front-end vertical hall magnetic sensor fabricated in 0.18 μm low-voltage CMOS technology

An integrated front-end vertical hall magnetic sensor fabricated in 0.18 μm low-voltage CMOS technology

Six Degrees of Freedom Displacement Measurement System for Wafer Stage Composed of Hall Sensors

A reconfigurable miniaturized transducer based on rotating coils for testing particle accelerator magnets

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