Calculation of composition of dilute cosputtered multicomponent films

Abstract

A method for calculating the composition of cosputtered films from calculated deposition profiles and measured film thicknesses has been shown to be applicable to high concentrations of each of the components. Four new modifications are described for concentrations ranging down to 0.1% or less, which employ alternate ways of determining deposition rates. Several examples of cosputtered Cu–Ni alloys show that the rms accuracy of the methods is about 25% of the amount of the solute. Cosputtered films of Al–Si so analyzed have been used as standards for instrumental methods of analysis.

Granular Metal Films

“…Hanak 94 further developed this technique and devised methods for computing compositions from the geometric shapes of the components of the target. 95 The target in Fig. The substrate is posi tioned parallel to the target at a distance of about 2 in.…”

“…94 - 95 The three basic assumptions made in this method are: (a) no chemical reaction takes place between the insulator and metal; (b) the thick ness of the sputtered film at any point in the substrate plane is equal to the superposition of film thicknesses that would be obtained by sputtering from each of the components of the target separately; and (c) the angular distribution of the deposition rate for each of the components of the target follows Knudsen's law. 1 and 2a and b, a rough estimate of the composition can be obtained from measurements of the thickness profile of the sputtered film.…”

A Combinatorial Screening Method for Corrosion Research Using Ion-Beam- Deposited Thin-Film Alloys and Microelectrochemical Measurements

“…The increase in current density above 1.3 V was due to mainly oxygen evolution. As many researches have already revealed, [23][24][25] Mo addition improves the pitting corrosion resistance of stainless steels. A similar effect of Mo addition is observed in Fig.…”

“…The point for establishing a combinatorial screening method is to find out the procedure that can produce compositional gradientcontrolled thin-films. In this study, we have used a cosputtering target [18][19][20][21][22][23] composed of small chips of alloying metals and a large plate of a matrix.…”