Bulk tracer diffusion in CoCrFeNi and CoCrFeMnNi high entropy alloys

Vaidya, M.; Pradeep, Konda Gokuldoss; Murty, B.S.; Wilde, Gerhard; Divinski, Sergiy V.

doi:10.1016/j.actamat.2017.12.052

Cited by 313 publications

(97 citation statements)

References 37 publications

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“…The comparison unambiguously substantiate that, at least, one has to use the results of the numerical inverse methods with a care. While the following ratio of the tracer diffusion coefficients is established by the direct method, D * Ni < D * Co < D * Fe < D * Cr [22,24], just opposite trends were found using the numerical inverse method in the work [31], see Fig. 6.…”

Section: Inverse Solutions Of Interdiffusion Problemmentioning

confidence: 92%

“…In Fig. 6 we are comparing the recently published data for the tracer diffusion coefficients in CoCrFeNi determined by the numerical inverse method [31], dashed lines, and the directly measured ones using appropriate radiotracers [22,24], solid lines. The comparison unambiguously substantiate that, at least, one has to use the results of the numerical inverse methods with a care.…”

Section: Inverse Solutions Of Interdiffusion Problemmentioning

confidence: 99%

“…At the moment, the Cantor alloys, i.e. CoCrFeNi and CoCrFeMnNi, are the most investigated systems with respect to the tracer diffusion [22,23,24]. Polycrystalline materials with the grain size of 200 µm or even more were produced by mold-casting and homogenized at 1200 • C for 50 h. Herec is the tracer concentration which is proportional to the relative specific radioactivity of the section (which is measured in an experiment), D * the tracer diffusion coefficient and t is the diffusion time.…”

Section: Tracer Measurementsmentioning

confidence: 99%

“…• Importance of both local activation barriers and correlation effects [24] CoCrFeNi, CoCrFeMnNi 1373 K • Radiotracer method ( 57 Co, 51 Cr, 59 Fe, 54 Mn, 63 Ni); • Single crystalline materials;…”

Section: Introductionmentioning

confidence: 99%

“…A perfect agreement of the concentration profiles measured in polycrystalline and single crystalline alloys proves the analysis made in Refs. [22,24] with respect to the subdivision of the total penetration profiles in two branches corresponding to bulk and grain boundary contributions. Moreover, tracer diffusion in Ref.…”

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confidence: 99%

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A Mystery of "Sluggish Diffusion" in High-Entropy Alloys: The Truth or a Myth?

Divinski

Покоев

Esakkiraja

et al. 2018

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High entropy alloys (HEAs) are considered as a novel class of materials with a large number of components (five and more) available in equiatomic or nearly equatomic proportions.One of the characteristic properties of HEAs was believed to be so-called 'sluggish' diffusion that should be crucial for intended high-temperature technological applications. The faith on this myth instead of rigorous experimental analysis played such a dominant role that the first set of data on interdiffusion, in fact based on an improper analysis, were cited in hundreds of articles to state the presence of sluggishness of diffusion rates in high entropy alloys.In this review, the recent data on atomic diffusion in HEAs are presented and critically discussed. The discussion is focused on tracer diffusion which is already measured dominantly for polycrystalline, but in some cases for single crystalline high-entropy alloys. The radiotracer technique provided a unique access to the diffusion rates of elements in the alloys and in fortunate cases these transport quantities could be measured in a single experiment, as in the case of Co, Cr, Fe and Mn diffusion in the CoCrFeMnNi HEA.Alternatively, a rigorous analysis of the interdiffuson experiments, which provide the diffusion rates of chemical species, too, becomes more and more sophisticated for three and more elements in an alloy and it is challenging to derive physically sound quantities from a general multicomponent diffusion experiment. Most promising in this case is the diffusion couple technique, especially the so-called pseudo-binary approach. This approach is analyzed with a focus on the applicability and the possible errors induced if up-hill diffusion appears.In the overview, it is shown that atomic diffusion in HEAs cannot a priori be considered as sluggish and both atomic interactions as well as correlation effects are responsible for the observed trends. Even if estimated on the same homologous scale, the diffusion retardation induced by a 'high entropy' in FCC crystals is not simply proportional to the number of alloying components and it is shown to be similar to that induced by, e.g., the L1 2 ordering in a binary system. Furthermore, the importance of cross-correlations in diffusion of different species in HEAs is highlighted. * Since there is no consensus about the way to list the principal elements in HEAs (alphabetic order, periodic table order, atomic percentage, etc), we will use the simple alphabetic order, as e.g. CoCrFeMnNi for the Cantor system.

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Section: Inverse Solutions Of Interdiffusion Problemmentioning

confidence: 92%

Section: Inverse Solutions Of Interdiffusion Problemmentioning

confidence: 99%

Section: Tracer Measurementsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

mentioning

confidence: 99%

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A Mystery of "Sluggish Diffusion" in High-Entropy Alloys: The Truth or a Myth?

Divinski

Покоев

Esakkiraja

et al. 2018

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Applications of High Diffusion Resistance Multi‐component AlCrTaTiZrRu/(AlCrTaTiZrRu)N_0.7 Film in Cu Interconnects

Chen

Jiang

et al. 2020

Adv Eng Mater

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Herein, a multi-component AlCrTaTiZrRu/(AlCrTaTiZrRu)N 0.7 double-layer structure is prepared by direct current (DC) magnetron sputtering as a diffusion barrier for Cu interconnection. To verify the diffusion-barrier properties at high temperatures, the Cu/AlCrTaTiZrRu/(AlCrTaTiZrRu)N 0.7 /Si structures are annealed at 700-900 C for 30 min in high vacuum. The barrier layer remains amorphous with few nanocrystalline structures after annealing at 800 C. Cu particle agglomeration begins to appear on the surface, but no Cu-silicide compound is found on the Si substrate, indicating that the layer can effectively defer the interdiffusion of Cu and Si. Under annealing at high temperature of 900 C, Cu silicides and other intermetallic compounds are formed on the surface of the Cu film, with the film resistivity increasing significantly, indicating that the AlCrTaTiZrRu/(AlCrTaTiZrRu)N 0.7 double-layer structures have completely failed.

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Nanoprecipitate‐Strengthened High‐Entropy Alloys

et al. 2021

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Multicomponent high-entropy alloys (HEAs) can be tuned to a simple phase with some unique alloy characteristics. HEAs with body-centered-cubic (BCC) or hexagonal-close-packed (HCP) structures are proven to possess high strength and hardness but low ductility. The faced-centered-cubic (FCC) HEAs present considerable ductility, excellent corrosion and radiation resistance. However, their strengths are relatively low. Therefore, the strategy of strengthening the ductile FCC matrix phase is usually adopted to design HEAs with excellent performance. Among various strengthening methods, precipitation strengthening plays a dazzling role since the characteristics of multiple principal elements and slow diffusion effect of elements in HEAs provide a chance to form fine and stable nanoscale precipitates, pushing the strengths of the alloys to new high levels. This paper summarizes and review the recent progress in nanoprecipitate-strengthened HEAs and their strengthening mechanisms. The alloy-design strategies and control of the nanoscale precipitates in HEAs are highlighted. The future works on the related aspects are outlined.

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Bulk tracer diffusion in CoCrFeNi and CoCrFeMnNi high entropy alloys

Cited by 313 publications

References 37 publications

A Mystery of "Sluggish Diffusion" in High-Entropy Alloys: The Truth or a Myth?

A Mystery of "Sluggish Diffusion" in High-Entropy Alloys: The Truth or a Myth?

Applications of High Diffusion Resistance Multi‐component AlCrTaTiZrRu/(AlCrTaTiZrRu)N_0.7 Film in Cu Interconnects

Nanoprecipitate‐Strengthened High‐Entropy Alloys

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Bulk tracer diffusion in CoCrFeNi and CoCrFeMnNi high entropy alloys

Cited by 313 publications

References 37 publications

A Mystery of "Sluggish Diffusion" in High-Entropy Alloys: The Truth or a Myth?

A Mystery of "Sluggish Diffusion" in High-Entropy Alloys: The Truth or a Myth?

Applications of High Diffusion Resistance Multi‐component AlCrTaTiZrRu/(AlCrTaTiZrRu)N0.7 Film in Cu Interconnects

Nanoprecipitate‐Strengthened High‐Entropy Alloys

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Product

Resources

About

Applications of High Diffusion Resistance Multi‐component AlCrTaTiZrRu/(AlCrTaTiZrRu)N_0.7 Film in Cu Interconnects