Building a Delamination-free Electronic Package Using Thermal Analysis Data

Dal, S.L.B.

doi:10.1109/iemt.2008.5507861

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) 2008

DOI: 10.1109/iemt.2008.5507861

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Building a Delamination-free Electronic Package Using Thermal Analysis Data

S.L.B. Dal

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Building a Delamination-free Electronic Package Using Thermal Analysis Data

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