Abstract:We investigate the effect of the annealing temperature and annealing time on the bubble evolution on the hydrogen ion (H + )-implanted germanium (Ge) substrate. It is found that the H 2 aggregates gradually with the increase of the annealing time, and the aggregation rate of the H 2 increases with the increase of the annealing temperature. Low-temperature Ge/Si wafer bonding (a-Ge interlayer) and Smart-Cut ™ technique are applied to fabricate high-quality Ge-on-insulator (GOI). It is proved that thick Ge film … Show more
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