2021 European Conference on Optical Communication (ECOC) 2021
DOI: 10.1109/ecoc52684.2021.9605899
|View full text |Cite
|
Sign up to set email alerts
|

Broadband Balanced Homodyne Detector for High-Rate (>10 Gb/s) Vacuum-Noise Quantum Random Number Generation

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1

Citation Types

0
2
0

Year Published

2022
2022
2024
2024

Publication Types

Select...
2
1

Relationship

0
3

Authors

Journals

citations
Cited by 3 publications
(2 citation statements)
references
References 12 publications
0
2
0
Order By: Relevance
“…80 A 3 GHz bandwidth die-level balanced homodyne detector with a significant quantum-to-classical noise removal of 19.1 dB was obtained. 81 A customized integrated TIA constructed in a 100 nm GaAs pHEMT technology was utilized in this co-integrated balanced homodyne detector. 82 A hybrid packaging was employed to amalgamate an InGaAs homodyne detector, a high-bandwidth TIA, and a photonic integrated circuit optimized for vacuum state quantum random number generator (QRNG) implementation.…”
Section: Measuring Squeezed Lightmentioning
confidence: 99%
“…80 A 3 GHz bandwidth die-level balanced homodyne detector with a significant quantum-to-classical noise removal of 19.1 dB was obtained. 81 A customized integrated TIA constructed in a 100 nm GaAs pHEMT technology was utilized in this co-integrated balanced homodyne detector. 82 A hybrid packaging was employed to amalgamate an InGaAs homodyne detector, a high-bandwidth TIA, and a photonic integrated circuit optimized for vacuum state quantum random number generator (QRNG) implementation.…”
Section: Measuring Squeezed Lightmentioning
confidence: 99%
“…Instead of a dedicated custom PIC and custom electrical integrated circuit (IC) designs, we are exploring the potential of existing commercially available chip-level components for both photonic as well as electronic elements, thus minimizing the parasitics and achieving low-noise operation. This paper is the extension of our initial works [15,16] and covers the performance characterization of different designs of die-level photodiode / transimpedance amplifier (TIA) assemblies in search for optimum design trade-offs for BHDs in view of quantum applications.…”
Section: Chip-level Ghzmentioning
confidence: 99%