2021
DOI: 10.1109/tthz.2021.3099064
|View full text |Cite
|
Sign up to set email alerts
|

Broadband 400-GHz InGaAs mHEMT Transmitter and Receiver S-MMICs

Abstract: The modeling, design and experimental evaluation of both a 400-GHz transmitter and receiver submillimeter-wave monolithic integrated circuit (S-MMIC) is presented in this paper. These S-MMICs are intended for a radar-based system in the aforementioned operating frequency. The transmitter occupies a total chip area of 750 × 2750 µm 2 . It consists of a multiplier-by-four, generating the fourth-harmonic of the WR-10 input signal, which drives the integrated WR-2.2 power amplifier. The latter has an output-gate w… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
2
1

Citation Types

0
6
0

Year Published

2022
2022
2024
2024

Publication Types

Select...
7
2

Relationship

3
6

Authors

Journals

citations
Cited by 13 publications
(6 citation statements)
references
References 38 publications
0
6
0
Order By: Relevance
“…Due to the highest electron mobility and saturation velocity, Indium Phosphide (InP) can achieve frequencies higher than 1THz. However, the material cost is high and wafer/chip handling is difficult [171].…”
Section: F Next Future Technologiesmentioning
confidence: 99%
“…Due to the highest electron mobility and saturation velocity, Indium Phosphide (InP) can achieve frequencies higher than 1THz. However, the material cost is high and wafer/chip handling is difficult [171].…”
Section: F Next Future Technologiesmentioning
confidence: 99%
“…The analysis of the transmitter-S-MMIC active chain is presented in [31]. It is composed of a multiplier-by-four (×4)-upconverting the input signal from the WR-10 (75-110 GHz) to the WR-2.2 frequency band-and a subsequent high power amplifier (PA) [31]. The corresponding on-wafer characterization is shown in Fig.…”
Section: Far-field Characterizationmentioning
confidence: 99%
“…For more information, see https://creativecommons.org/licenses/by/4.0/ dc and RF ground, thin-film-microstrip lines (TFMSLs) with a MET2 and MET3 signal line are utilized for the routing of the matching and bias insertion networks, independent of the Si substrate. A more detailed description of the BEOL process and possible layer configurations for compact TFMSL networks are, furthermore, given in [7] and [8].…”
Section: Technologymentioning
confidence: 99%