Broad-banding technique for in-phase hybrid ring equal power divider

Ooi, Boon-Teck; Palei, W.; Leong, Mook‐Seng

doi:10.1109/tmtt.2002.800431

Cited by 26 publications

(1 citation statement)

References 4 publications

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“…One such implementation is using Gysel cell (Gysel power divider), which provides improvements in isolation levels at the ports. It is important to mention that the use of Gysel cell is not the unique solution available to implement a CORPS-BFN 6 . Instead, Circular In-phase hybrid ring power divider can also be used but it is hard to tune its physical parameters for optimisation.…”

Section: Introductionmentioning

confidence: 99%

Design and Implementation of a Beam Forming Network for a Phased Array Antenna

Devimeena¹,

Venkatesh²

2015

DSJ

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Section: Introductionmentioning

confidence: 99%

Design and Implementation of a Beam Forming Network for a Phased Array Antenna

Devimeena¹,

Venkatesh²

2015

DSJ

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Power Combining

general

2009

High Efficiency RF and Microwave Solid State Power Amplifiers

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Power amplifiers are employed in a variety of system applications, where the required power levels are largely different, varying from mW to kW [1,2]. Consequently, a wide variety of PA realizations results, from travelling-wave tube amplifiers in very high power systems [3,4], in satellite payloads or radars, to solid-state amplifiers for medium-low power systems [5,6], such as wireless communication handsets. The request for high output power levels is influencing device technologies adopted for PA module realization [7,8]. Prior to the development of solid state devices, microwave power amplification and generation were mainly based on the use of vacuum tubes [9, 10], including magnetron, klystron and travelling-wave implementations (TWTAs) [4,11]. These devices still remain in use at kilowatt levels, where solid-state devices cannot compete so far.Nevertheless, the development of high power microwave solid-state device technologies (GaAs HEMT or HBT, GaN HEMT, etc.) may offer an order-of-magnitude improvement in reliability and reduction in size, weight, and low-voltage power-supply requirements as compared to vacuum devices. However, the output power attainable from a single solid-state device is basically limited by thermal and impedance matching problems. To meet system requirements it is therefore mandatory to combine several devices, thus attaining higher power levels. Many power splitting/combining schemes have been investigated and developed, involving different technologies and propagation media, ranging from metal waveguides (cavities, microstrips, striplines, etc.) where the power is confined into a limited region, to open space configurations [12][13][14].Devices involved in power splitting/combining operations are referred to as power splitters/ combiners and they play a key role in the design of high power PA, while being also fundamental components in designing mixers [15], multipliers and oscillators [16,17], or other linear and nonlinear circuits [18]. Moreover, since the proposed schemes can often be adopted for both the tasks of power division and combination, the terms power combining and power splitting are usually adopted simultaneously or interchangeably. Due to their intrinsic reciprocal characteristic in fact, the same device can alternatively be viewed as a power combiner or as a power splitter, depending on the selection of its input and output ports.The key features of power splitting/combining devices are clearly their insertion loss (related to the efficiency), bandwidth and size. The techniques adopted for the optimization of device performance are strictly related to the type of splitting/combining structure and to the selected realization technology. High Efficiency RF and Microwave Solid State Power Amplifiers

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A novel quasi symmetrical design of the three‐way Gysel power divider using ideal phase inverters

Zhang

Yang

Liao

et al. 2020

Int J RF Microw Comput Aided Eng

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A novel quasi symmetrical three‐way Gysel power divider with frequency‐independent isolation and impedance matching is proposed. Equal magnitudes of the reflection coefficients for the input and the output ports of the three‐way divider can be obtained despite the asymmetrical structure and the different terminal impedances. The divider is analyzed in terms of its equivalent four‐port network. Quasi symmetrical property (|S11| = |Sii|, i = 2‐4) is proved which means the input port (port. 1) will automatch when the output ports are matched. Closed‐form equations are derived for the design. For verification, based on the microstrip/slotline PI, two examples, which include a three‐way Gysel PD with port impedances (50, 50, 50, 50) Ω, and an ultra‐wideband three way Gysel PD with port impedances (50, 100, 100, 100) Ω with the center frequency of 4 GHZ are designed, fabricated, and measured respectively. The measured results are in great agreement with the simulated ones.

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Broad-banding technique for in-phase hybrid ring equal power divider

Cited by 26 publications

References 4 publications

Design and Implementation of a Beam Forming Network for a Phased Array Antenna

Design and Implementation of a Beam Forming Network for a Phased Array Antenna

Power Combining

A novel quasi symmetrical design of the three‐way Gysel power divider using ideal phase inverters

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