“…A crucial method is optimizing the performance of the selector, which is expected to be CMOS compatibility, with a high driving current, a large selectivity, a small threshold voltage, and great endurance . Recently, the selectors based on oxide diodes have revealed a great potential in achieving a highly integrated memory array. − SK Hynix has demonstrated an innovative oxide selector As-included SiO 2 , which has achieved reliable threshold switching characteristics for cross-point memory . In this work, we investigated another common oxide material in the semiconductor industry, HfO 2 as a matrix oxide material, which is also one of the conventional dielectric materials.…”
mentioning
confidence: 99%
“…10−12 SK Hynix has demonstrated an innovative oxide selector As-included SiO 2 , which has achieved reliable threshold switching characteristics for cross-point memory. 13 In this work, we investigated another common oxide material in the semiconductor industry, HfO 2 as a matrix oxide material, which is also one of the conventional dielectric materials. Previous work has found that the threshold voltage (V th ) and leakage current can be controlled by As ions.…”
A large
crossbar array is desirable for high-density 3D stacking
phase change memory (PCM) applications, in which the leakage current
is mainly decided by selector devices. Meanwhile, a large driving
current is also needed to meet the Reset operation of the PCM cell.
Here, we propose a selector based on a nanoscale HfO2 film
via As ion implantation, which has a low threshold voltage of 1.9
V, a milliamp-scale high driving current, a large selectivity of 106, fast turn on speed, and good endurance (108 switching
cycles). These excellent performances make it applicable in the high-density
stacked PCM application.
“…A crucial method is optimizing the performance of the selector, which is expected to be CMOS compatibility, with a high driving current, a large selectivity, a small threshold voltage, and great endurance . Recently, the selectors based on oxide diodes have revealed a great potential in achieving a highly integrated memory array. − SK Hynix has demonstrated an innovative oxide selector As-included SiO 2 , which has achieved reliable threshold switching characteristics for cross-point memory . In this work, we investigated another common oxide material in the semiconductor industry, HfO 2 as a matrix oxide material, which is also one of the conventional dielectric materials.…”
mentioning
confidence: 99%
“…10−12 SK Hynix has demonstrated an innovative oxide selector As-included SiO 2 , which has achieved reliable threshold switching characteristics for cross-point memory. 13 In this work, we investigated another common oxide material in the semiconductor industry, HfO 2 as a matrix oxide material, which is also one of the conventional dielectric materials. Previous work has found that the threshold voltage (V th ) and leakage current can be controlled by As ions.…”
A large
crossbar array is desirable for high-density 3D stacking
phase change memory (PCM) applications, in which the leakage current
is mainly decided by selector devices. Meanwhile, a large driving
current is also needed to meet the Reset operation of the PCM cell.
Here, we propose a selector based on a nanoscale HfO2 film
via As ion implantation, which has a low threshold voltage of 1.9
V, a milliamp-scale high driving current, a large selectivity of 106, fast turn on speed, and good endurance (108 switching
cycles). These excellent performances make it applicable in the high-density
stacked PCM application.
Considering a high‐density vertical X‐point memory array, the film thickness of an active device for the selector and memory needs to be scaled down. Here, the authors propose an AgTe/HfOx‐based hybrid memory device with a film thickness of less than 10 nm by adopting a bilayer (HfO1.8/HfO2) film using precise composition control. Non‐volatile switching characteristics can be obtained by considering the formation of stable nanoscale Ag filaments in the nanoporous region in non‐stoichiometric HfO1.8 deposited via sputtering. By contrast, volatile switching characteristics are achieved by an unstable atomic‐scale Ag path in stoichiometric HfO2 deposited via plasma‐enhanced atomic layer deposition. Based on density functional theory calculations, it is confirmed that the stoichiometry of the HfOx film is the key parameter that controls the switching characteristics. The bilayer (HfO1.8/HfO2) device exhibits excellent hybrid memory characteristics, such as distinct read margin (>1.5 V), high ON/OFF ratio (>106), and extremely low OFF current (≈pA), for vertical X‐point memory applications.
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