“…Size control of shrunk particles in a tightly packed periodic PS array is important to create mesh structures and extend the application of NSL. To this end, RIE, [ 97,98 ] ion beam etching (IBE), [ 99 ] plasma etching (PE), [ 21,85,97,100,101 ] and inductively coupled plasma etching (ICPE) [ 102,103 ] can be used. Different gases including O 2 , [ 85,104,105 ] Ar, [ 85 ] O 2 /Ar, [ 21 ] or CF 4 /O 2 [ 106 ] are applicable for the plasma etching processes, resulting in varied etching speeds and particle surface roughness.…”