Brazing of zirconia with AgCuTi and SnAgTi active filler metals

Abstract

The self-brazing of partially stabilized zirconia using Ag27Cu3Ti and Sn10Ag4Ti active filler metals is investigated. It was shown that the contact angles of Ag27Cu3Ti and Sn10Ag4Ti on zirconia decreased with the increase of brazing temperature and remained constant at about 34 deg and 44 deg above 900 ЊC, respectively. The flexural strengths were 227 and 137 MPa for ZrO 2 /Ag27Cu3Ti/ ZrO 2 and ZrO 2 /Sn10Ag4Ti/ZrO 2 , respectively, after brazing at 900 ЊC for 10 minutes.In these brazing systems, the titanium in the filler metals segregated at the interface and formed a TiO reaction layer responsible for the wetting and bonding when a ZrO 2 ceramic is brazed with Ag27Cu3Ti and Sn10Ag4Ti filler metals. Interfacial analyses by electron probe microanalysis (EPMA) showed that such TiO reaction layers of ZrO 2 /Ag27Cu3Ti and ZrO 2 /Sn10Ag4Ti possessed similar thicknesses at the same brazing condition, implying that the TiO interfacial reaction layers of both brazing systems were of the same nature and formation kinetics.

Wettability of transparent YAG (Y3Al5O12) by molten Ag–Cu–Ti alloys

“…Ag, Ti, Cu rods (purity >99.9%) or wires of CB4 (Degussa-Germany) alloys were used. The CB4-AgCuTi alloy has a density of 9.9 g cm −3 , a thermal expansion coefficient equal to 18 × 10 −6 /K, a melting range of 780-805 • C [25] and is considered a member of a family defined as medium-meltingpoint active fillers (melting point between 700 • C and 1000 • C [26,27]). The compositions of all alloys used are reported in Table 1.…”

Effects of titanium on active bonding between Sn3.5Ag4Ti(Ce,Ga) alloy filler and alumina

“…[2] to enhance the activity. However, the interfacial thermal stress generated due to the difference in thermal-expansion coefficients of the ceramic and metal during the cooling process after welding might deteriorate the joints [3,4]. To solve this problem, low melting-point Sn base active fillers have been developed, as the melting-point of the Sn base solder is the lowest among all the solders.…”

Microstructures and interfacial behavior of zirconia/stainless steel joint prepared by pressureless active brazing

“…In particular, by the addition of Ti to some alloys this method can promote lower contact angles and hence wetting. Over the past decades, many investigated the joining of zirconia to metals or ceramics with these alloys added with active Ti, such as Ag-base [1][2][3][4][5][6][7][8][9][10][11][12][13][14], Cu-base * Corresponding authors.…”