Bottlenecks and strategies of green mold compounds

As the electronics industry migrates to the leadand halogen-free (green) packages, many of the materials used in plastic ball-grid array (PBGA) substrates, in particular the molding compounds and die attaches, will have to be improved. The moisture sensitivity level (MSL) performance of the large nongreen PBGA packages are typically reduced by at least one JEDEC/IPC level at the lead-free reflow temperature of 260 C. Common failure mechanisms of traditional large size PBGA packages include popcorning, as well as delamination and cracks between the solder mask/copper interface in the multiple layer substrates.In this paper, the interfacial adhesion of traditional and advanced substrate materials and processing technologies are presented based on reliability tests of various PBGA packages subject to moisture soaking followed by reflow soldering at 260 C. It was found that substrate failures with delamination at the solder mask/copper interface were dramatically improved by introducing advanced materials and processes for multiple-layer substrates. However, the partial or full delamination at the mold compound/solder mask interface could still be observed after lead-free reflow soldering. There is an urgent need to improve the adhesion between mold compound/solder mask in order to achieve high MSL performance of large size and green PBGA packages.Index Terms-Green electronics, lead free soldering, moisture sensitivity level (MSL), plastic ball-grid array (PBGA).

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“…The assessment flow chart is shown in Fig. 2 [5]. For each MSL level assessment a new set of packages are used.…”

Section: A Impact Of Reflow Soldering Temperature (260 C) On Msl Of mentioning

confidence: 99%

The Influence of Substrate Enhancement on Moisture Sensitivity Level (MSL) Performance for Green PBGA Packages

Lin¹,

Pecht

Das

et al. 2006

IEEE Trans. Comp. Packag. Technol.

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“…This is due to the higher melting point of the most commonly used lead free alternatives to conventional Sn-Pb solder. 71,72 As with Pb free solder, there are too many patented systems to list here. Unfortunately, relatively few papers on the subject exist in the open literature.…”

Section: Lower Toxicity Ic Packagingmentioning

confidence: 99%

Green chemistry in the microelectronics industry

O'Neil

Watkins

2004

Green Chem.

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Microelectronic devices and materials now represent one of the largest manufacturing sectors in the world. Like many large industries, growth has been accompanied by increasing concerns regarding environmental emissions and impact. One challenge for the high end of the market is the identification of alternative process technologies that are not just "greener" but provide compelling technical advantages that could foster adaptation. This review examines a few opportunities where this is possible, including the use of supercritical fluids such as carbon dioxide in advanced device fabrication. The implementation of more acceptable materials in commodity markets, including lead free solder for printed wiring boards, is also discussed.

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“…They are separated into individual units by the final process of Singulation Saw 1 . Given the molding compound property 2 and process limitation, a compound residue is easy to arise during Singulation Saw. frame of the work piece and the Z2 blade cuts off the compound underneath through the slot cut by the Z1 blade.…”

Section: Introductionmentioning

confidence: 99%

The Removal of Compound Residue in Semiconductor Assembly

Liu¹,

Wu²,

He³

2014

ECS Trans.

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In the semiconductor assembly, the step cut is always used for the Singulation Saw process of non-lead packages. Due to the compound’s property, there is a compound residue left after the Singulation Saw. The residue is an insulating compound trace and easy to drop on the PCB to cause an electrical open in the customer SMT line. According to the study result, the new saw blade with V shape edge is introduced, which can break through the compound directly and eliminate the opportunity of residue arising in Saw Singulation process.

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Bottlenecks and strategies of green mold compounds

Cited by 11 publications

References 18 publications

The Influence of Substrate Enhancement on Moisture Sensitivity Level (MSL) Performance for Green PBGA Packages

The Influence of Substrate Enhancement on Moisture Sensitivity Level (MSL) Performance for Green PBGA Packages

Green chemistry in the microelectronics industry

The Removal of Compound Residue in Semiconductor Assembly

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