2019
DOI: 10.1016/j.apenergy.2019.01.153
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Boron nitride foam as a polymer alternative in packaging phase change materials: Synthesis, thermal properties and shape stability

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Cited by 75 publications
(31 citation statements)
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“…Most CPCM with the addition of metal oxide nanoparticles such as nano-CuO, nano-TiO 2 , and nano-Al 2 O 3 have desired performance, excluding beryllium oxide nanoparticles (nano-BeO). [39][40][41][42] Nonoxide nanoparticle additives have strong interatomic bonding energies and crystal structures, including nano-BN, [43][44][45][46] nano-SiC, [47,48] and nano-Si 3 N 4 , [49][50][51] which can notably exhibit high thermal conductivity by decreasing phonon scattering. In consequence, aluminum nitride nanoparticles (nano-AlN) and nano-BN as additives are extensively used to enhance the thermal properties of CPCM.…”
Section: D Structure Additivesmentioning
confidence: 99%
“…Most CPCM with the addition of metal oxide nanoparticles such as nano-CuO, nano-TiO 2 , and nano-Al 2 O 3 have desired performance, excluding beryllium oxide nanoparticles (nano-BeO). [39][40][41][42] Nonoxide nanoparticle additives have strong interatomic bonding energies and crystal structures, including nano-BN, [43][44][45][46] nano-SiC, [47,48] and nano-Si 3 N 4 , [49][50][51] which can notably exhibit high thermal conductivity by decreasing phonon scattering. In consequence, aluminum nitride nanoparticles (nano-AlN) and nano-BN as additives are extensively used to enhance the thermal properties of CPCM.…”
Section: D Structure Additivesmentioning
confidence: 99%
“…Hexagonal boron nitride (h‐BN) has superior thermal conductivity, electrically insulating, outstanding oxidation resistance, excellent corrosion resistance, and remarkable dielectric properties. [ 29‐32 ] Qian et al . enhanced the thermal conductivity and form stability of paraffin with h‐BN porous scaffolds.…”
Section: Background and Originality Contentmentioning
confidence: 99%
“…enhanced the thermal conductivity of commercial polystyrene filled with core‐shell structured BN@PS [ 34 ] and used BN foam as a polymer alternative in packaging PCMs. [ 31 ] These BN fillers have higher thermal conductivity than traditional BN. Therefore, we continue to use this group of high thermal conductivity BN to improve the thermal conductivity of the component.…”
Section: Background and Originality Contentmentioning
confidence: 99%
“…The incipient nano-technology presents several superior solutions to this issue which have shown good potential in this regards [9,10]. Literature also shows that it is possible to use specific coatings that prevent the negative effect of flames of PU foam [11][12][13][14][15][16].To enhance the thermal performance of PU foam, however, literature has also presented several innovative ideas that include the use of PCMs as a sustainable material with little environmental impact.Attempts of incorporation of PCMs for within the matrix of PU foams have shown to be successful in terms of increasing insulation capabilities [17][18][19][20][21][22][23][24][25]. Various methods have been devised for this purpose such as direct amalgamation of PCMs and incorporation of polymer micro-encapsulated PCMs [17][18][19][20][21][22][23][24][25].It is worthy to note that other useful purposes such as thermal storage have been seen to benefit from such incorporation [26][27][28][29].This approach has proven to be promising from the perspective of thermal performance.However, many PCMs are inherently flammable, especially in the case of wax-based PCMs such as paraffin wax, which seems to be of interest to many due to other advantageous characteristics.…”
Section: Introductionmentioning
confidence: 99%