1978
DOI: 10.1143/jjap.17.1839
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Boron Implantation into Si Using B2O3and B Mixture for Ion Source Material

Abstract: B2O3 and B mixture for ion source material produced B2O2+ and B+ ions of large contents, which can be useful solid source material for B+ ion implantation. Auger electron spectroscopy was employed to investigate the depth distributions of B and O which are components of mainly B2O2+ and B+ ions implanted into Si at the same energy. It is found that only B+ ion can be doped in Si through a SiO2 layer by means of implantation using B2O3 and B mixture for ion source material without mass selection.

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“…Here, the common approach utilizes statistical thermal sources which provide a dense ion beam that has to be thinned out by several choppers and apertures. To ensure single ion implantation it is necessary to detect the implantation event by observing the generated Auger electrons, photoluminescence, phonons, electron-hole pairs or changes in the conductance of a field effect transistor [11,12,13,14,15]. Therefore, the implantation only works if either the ions are highly charged or if they are implanted with large kinetic energies.…”
Section: Motivationmentioning
confidence: 99%
“…Here, the common approach utilizes statistical thermal sources which provide a dense ion beam that has to be thinned out by several choppers and apertures. To ensure single ion implantation it is necessary to detect the implantation event by observing the generated Auger electrons, photoluminescence, phonons, electron-hole pairs or changes in the conductance of a field effect transistor [11,12,13,14,15]. Therefore, the implantation only works if either the ions are highly charged or if they are implanted with large kinetic energies.…”
Section: Motivationmentioning
confidence: 99%