Excellent surface passivation of heavily boron or phosphorus doped crystalline silicon is presented utilizing undoped hydrogenated amorphous silicon (a-Si:H). For passivating boron doped crystalline silicon surfaces, amorphous silicon needs to be deposited at low temperatures 150 °C≤Tdep≤200 °C, leading to a high bandgap. In contrast, low bandgap amorphous silicon causes an inferior surface passivation of highly boron doped crystalline silicon. Boron doping in crystalline silicon leads to a shift of the Fermi energy towards the valence band maximum in the undoped a-Si:H. A simulation, implementing dangling bond defects according to the defect pool model, shows this shift in the undoped a-Si:H passivation to be more pronounced if the a-Si:H has a lower bandgap. Hence, the inferior passivation of boron doped surfaces with low bandgap amorphous silicon stems from a lower silicon-hydrogen bond energy due to this shift of the Fermi energy. Hydrogen effusion and ellipsometry measurements support our interpretation.