“…Quantitative results, selection of leaching agents and optimum conditions of the leaching process, obtained by various authors, differed remarkably from each other. Numerous acids (nitric (Santos et al, 1990), sulphuric (Voos, 1961), hydrochloric (Santos et al, 1990;Zhang et al, 2009) and hydrofluoric (Voos, 1961;Santos et al, 1990;Ma et al, 2009)), their mixtures (Dietl, 1983;Norman et al, 1985), and even water (Santos et al, 1990;Hunt et al, 1976aHunt et al, , 1976bChu and Chu, 1983) were found in different studies as efficient leaching agents. Double-step leaching of MG-Si at elevated temperature using hydrochloric acid (16%, 5 h, 80uC) and a relatively coarse particle fraction (116 mm), followed by hydrofluoric acid (2?5%, 2 h, 80uC), removed y85% of the impurities and resulted in 99?9% pure upgraded metallurgical grade silicon (UMG-Si) (Santos et al, 1990).…”