Effect of active element on interfacial microstructures and bonding strength of brazed AlN/AlN joints has been investigated and compared with the case of brazed Si 3 N 4 /Si 3 N 4 joints. Brazing was carried out at 1173 to 1473 K for 3.6 ks in a vacuum using AgCu filler metals containing Ti, Zr, V and Nb as an active element. The obtained joint had no defects such as unbonded areas, regardless of active element and bonding temperature. Four kinds of active elements were divided into two groups by shear tests and microstructural observations. One was Ti and Zr, and the other was V and Nb. The bonding strength of the former was higher than that of the latter. In par ticular, the joint with Ti addition showed an excellent strength of about 200 MPa. Main fracture position in the joints with Ti and Zr additions was within the AlN, while most joints with V and Nb additions broke at the inter face between the active filler metal and the AlN. In the former, TiN and ZrN layers consisting of fine grains were observed adjacent to the AlN. On the other hand, the joint with Nb addition had roundish grains of Nb 2 N in similar locations. It was considered that the existence of fine grains contributed to the enhancement of bonding strength due to the increase of contact area and to the formation of complicated interface. These tendencies were essentially consistent with those of the