Bonding mechanism of lead-free solder and glass plate by ultrasonic assisted soldering method

Yonekura, Daisuke; Ueki, Tomoyuki; Tokiyasu, Kazushige; Kira, Shuji; Wakabayashi, Toshio

doi:10.1016/j.matdes.2014.10.024

Cited by 25 publications

(4 citation statements)

References 33 publications

(39 reference statements)

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“…Yonekura et al [ 19 ] studied Sn–Zn–Sb solder bonding (~ 350 °C soldering reflow temperature with > 200 °C melting point) to glass and found that the solder could only wet the glass when using ultrasonic assistance. They achieved bonding shear strength ranging from 1.03 to 5.93 MPa, with an average value of 2.90 Mpa.…”

Section: Introductionmentioning

confidence: 99%

Ceramic-to-metal bonding using rare-earth containing Sn–Bi solder

Feng,

Pati,

Chung

et al. 2024

J Mater Sci: Mater Electron

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With the increasing miniaturization and power of optoelectronic devices, direct bonding of optical substrates like semiconductors and ceramics to metal heat sinks using low melting-point solder has gained significant interest. In this study, we demonstrated the bonding of glass to copper using Sn-58 wt% Bi solder (SB solder) doped with a small amount of rare earth (RE) elements. The RE elements act as active agents that facilitate the bonding to glasses without glass metallization. By optimizing the bonding parameters, such as reflow temperature and time, and employing an inert gas atmosphere to prevent solder or RE oxidation, we successfully achieved the highest shear strength in glass-copper solder joints using SB-RE solder, without the need for ultrasonic-assisted soldering (UAS). These results demonstrate the potential of using RE-containing solder for bonding unmetallized glass and ceramics in optoelectronic devices with metals at low soldering temperatures (< 200 °C). Furthermore, analysis of the shear strength and failure morphology of solder joints revealed only small degradation, primarily originating from the bulk solder region rather than the solder-glass interface, after both thermal aging (100 h) and cycling tests (100 cycles). The establishment of low-melting point RE-containing solders opens the possibility of direct jointing ceramic optoelectronic substrates to metal heat sinks for more efficient heat dissipation. In the meantime, our work also suggests that further optimization studies are necessary to explore its performance under more extreme working conditions.

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Section: Introductionmentioning

confidence: 99%

Ceramic-to-metal bonding using rare-earth containing Sn–Bi solder

Feng,

Pati,

Chung

et al. 2024

J Mater Sci: Mater Electron

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“…This technique also needs high temperatures above 400 °C as well as the application of high voltage of the order 500 V for silicate glasses such as soda-lime glass and borosilicate glass. Ultrasonic soldering is a useful bonding technique 8,9) and requires an ultrasonic soldering iron. Ultrasonic treatment creates cavitation in soldering iron melts, then creates dangling bonds on the surface 10,11) in a phenomenon called cavitation erosion 12,13) that can form strong bonds that are hermetic.…”

Section: Introductionmentioning

confidence: 99%

Structural study of hermetic seal formed by water glass at low temperature when trapped between glass plates

Takamure¹,

Granados²,

Fukata³

et al. 2022

Jpn. J. Appl. Phys.

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Hermetic sealing is an important technology in applications such as packaging of MEMS, sensors and vacuum glazing. Hydrocarbon materials like cyanoacrylate “super glue” have been used for convenient sealing. However, it is known that cyanoacrylate and other hydrocarbon glues are permeable to water vapour and do not act as a hermetic seal. On the other hand, there are some hermetic sealing techniques such as anodic bonding, ultrasonic solder bonding, solder glass bonding with or without laser assistance that require high process temperatures and are of high cost. In this paper, we assess water glass for low-cost hermetic sealing of soda lime glass at low temperatures of less than 100 °C. The vacuum level in a sample encapsulation was measured by means of a spinning rotor gauge which showed no pressure increase for one year. In addition, the bonding strength was also measured, showing that the 80 °C annealing process is the best process temperature for the highest adhesion strength.

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“…Sn-Ag-Cu alloys welder sample was excessively utilized through the latter days. The lead-free solder has been developed currently due to the harmful impact on the environment and human health [3][4][5]. Significant studies has been concentrated on the composition of Sn-Ag-Cu (SAC) [6][7][8][9] nanoparticles is appropriate and nominee for production of lead-free solders because of the lessening of melting degree.…”

Section: Introductionmentioning

confidence: 99%

Effect of addition of GO Nanoparticles on the tensile properties and deformation temperature of Sn-3.5Ag-0.7Cu lead free solder alloy

Salem

2018

Arab Journal of Nuclear Sciences and Applications

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The advantage of lead-liberated welding is the melting point of SnAg -Cu (SAC) alloys in the Sn-rich alloy. Nanoparticles welding which requires lowering melting point near the Sn-Pb eutectic point is getting a growing interest. Recently, the phase persistence of nanoparticles has been the project of massiveness of academic and experiential investigations. In this study, graphene nanoparticles (GNPa) with 0.3 percentages wt. % were successfully added into Sn-3.5Ag-0.7Cu lead-free solder. The effects of graphene nanoparticles (GNPa) on the microstructure, tensile properties, wettability, corrosion resistance, and hardness were subsequently investigated. The results show that graphene nanoparticles (GNPa) refine the microstructure with different features and enhance the wettability efficiently. Stressstrain tests show that the combined solder containing 0.3 wt graphene nanoparticles (GNPa) exhibits about 15% and 25% enhancement in tensile strength and hardness, respectively. In addition, the total elongation of Sn-3.5Ag-0.7Cu is 22% greater than that of the pure Sn-3.5Ag-0.7Cu-0.3GO solder alloy. The enhancing mechanism of 0.3GO on the achievement of combined samples is also studied. Stress strain experiments were inspected under different five strain rates ranging from 5.4x10-5 S-1 to 2.9x10-3 S-1 and different five temperatures extended from R.T. (298K) to 383 K for two alloys. The activation enthalpy suggests that the dominant mechanism is the grain bounding diffusion (GBD). Also, X-ray diffraction examination display the permanence of both β-Sn rich phase and the intermetallic compound Ag 3 Sn and very little particles or residue from the intermetallic composition γ-In Sn 4 .

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Bonding mechanism of lead-free solder and glass plate by ultrasonic assisted soldering method

Cited by 25 publications

References 33 publications

Ceramic-to-metal bonding using rare-earth containing Sn–Bi solder

Ceramic-to-metal bonding using rare-earth containing Sn–Bi solder

Structural study of hermetic seal formed by water glass at low temperature when trapped between glass plates

Effect of addition of GO Nanoparticles on the tensile properties and deformation temperature of Sn-3.5Ag-0.7Cu lead free solder alloy

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