Bonding condition design methodology using Sn-Ag thin film for 3DIC

Abstract

We achieve a 3DIC stacking methodology using a Sn-Ag thin film under low temperature, low pressure, low vacuum, and short time period. For practical use, it is necessary to derive an appropriate bonding condition corresponding to each bonding target. In this study, we make up a numerical model based on the bonding process. At last, report on system construction to design a proper condition of the bonding process. Keywords-3DIC;solid-state bonding Sn-Ag; low temperature bonding; system design;I.