Bond Strength Evaluation in Dissimilar Materials

Ojard, G.; Rehbein, D. K.; Buck, O.; Bevolo, A. J.

doi:10.1007/978-1-4615-3742-7_32

Cited by 5 publications

(7 citation statements)

References 7 publications

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“…In this case, intimate contact at an interface without diffusion has been observed to cause a reflection having the same amplitude as that predicted from a good bond (4). Fortunately, advancements in instrument electronics, transducer design, and the use of high speed digital processing have promoted many new techniques to be developed which offer improved sensitivity in the evaluation of these conditions.…”

Section: Prior Workmentioning

confidence: 77%

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Ultrasonic evaluation of beryllium-copper diffusion bonds

Jamieson¹

2000

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SummaryConventional peak amplitude ultrasonic techniques have proven to be unreliable when used to evaluate solid state bonds. Of particular concern are bonds of intermediate strength that would pass a typical ultrasonic examination. These are commonly called "kissing bonds." Several advanced ultrasonic techniques were compared to determine the best technique for predicting the bond strength of diffusion bonded beryllium-copper. After an extensive literature search, several advanced ultrasonic techniques were chosen for inclusion in this study. Integrated backscatter calculations, frequency domain reflection coefficients, and time-of-flight variance techniques, which showed varying degrees of success on other material interface systems, were compared in their ability to characterize the bond strength of twenty-two beryllium-copper diffusion bond samples with varying bond qualities. Modifications to previously reported time-of flight histogram and reflection coefficient techniques were also suggested and implemented as a part of this study.Correlation of integrated backscatter calculations and time-of-flight variance with bond strength was good for low, intermediate, and high strength bonds. Correlation of the slope of the frequency based reflection coefficient was poor when considering all bond strengths; however, some correlation was found for medium and high strength bonds. The Y-intercept of the frequency based reflection coefficient curve showed moderate correlation for all bond strengths. 2 Discussion Scope and PurposeDiffusion bonding is a joining process that is becoming increasingly popular as a metallurgical joining method, and offers many advantages over other processes such as fusion welding and brazing. It allows similar and dissimilar metals to be joined at temperatures that are not only far below their melting temperature, but in many cases below their heat treating and annealing ranges. It can also avoid the drastic changes in microstructure typically seen in and adjacent to fusion welds, and the numerous undesirable conditions that can occur during the solidification process. The diffusion bonding process involves applying pressure at an elevated temperature to two samples which have their mating surfaces prepared as flat and smooth as possible. Initially, diffusion begins where contact is made between the two surfaces at the highest points. As the pressure and heat are increased, plastic deformation causes the interface to transform into one of isolated voids, thus increasing the contact area and the rate of diffusion. The voids are then reduced in size until they are completely closed, at which time the rate of atomic diffusion is a maximum. This process is accomplished principally by interstitial or vacancy diffusion, depending upon the materials at the interface (1,2).The quality of a diffusion bond, as in other bonds, is of critical importance in ensuring the proper performance of the bond for its intended application. Nondestructive test methods, particularly ultrasonic techniques,...

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Section: Prior Workmentioning

confidence: 77%

“…al. also reported success in utilizing the normalized energy calculations on dissimilar bonds of copper/nickel; however, the single frequency reflection coefficients were unsuccessful in correlating with bond strength (4,9). A novel approach was reported by Nieters et.…”

Section: Prior Workmentioning

confidence: 99%

Ultrasonic evaluation of beryllium-copper diffusion bonds

Jamieson¹

2000

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“…There is strong evidence that the elimination of voids at the bond line does not guarantee parent metal mechanical properties (7,12,13). Two types of defects could still be present that would produce weak mechanical properties.…”

Section: Bond Strength and Interdiffusionmentioning

confidence: 99%

“…A third category of defects is the "kissing bond" which has been found to be difficult to detect (13,14).…”

Section: A Diffusion Bonding Of Similar Materialsmentioning

confidence: 99%

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Strength, ultrasonic and metallurgical evaluation of diffusion bonds of dissimilar materials

Ojard

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INFORMATION TO USERSThis manuscript has been reproduced from the microfîhn master. UMI films the text directly from the original or copy submitted. Thus, some thesis and dissertation copies are in typewriter face, while others may be from any type of computer printer.The quality of this reproduction is dependent upon the quality of the copy submitted. Broken or indistinct print, colored or poor quality illustrations and photographs, print bleedthrough, substandard margins, and improper alignment can adversely affect reproduction.In the unlikely event that the author did not send UMI a complete manuscript and there are missing pages, these will be noted. Also, if unauthorized copyright material had to be removed, a note will indicate the deletion.Oversize materials (e.g., maps, drawings, charts) are reproduced by sectioning the original, beginning at the upper left-hand comer and continuing from left to right in equal sections with small overlaps. Each original is also photographed in one exposure and is included in reduced form at the back of the book.

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Ultrasonic evaluation of the bonding strength of dissimilar metal bonds

Katô

Abet

1996

NDT & E International

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Bond Strength Evaluation in Dissimilar Materials

Cited by 5 publications

References 7 publications

Ultrasonic evaluation of beryllium-copper diffusion bonds

Ultrasonic evaluation of beryllium-copper diffusion bonds

Strength, ultrasonic and metallurgical evaluation of diffusion bonds of dissimilar materials

Ultrasonic evaluation of the bonding strength of dissimilar metal bonds

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