Board on chip-ball grid array (BOC-BGA/sup TM/) package. A new design for high frequency application (package design and reliability)

Yew, Chee-Kiang; Ong, Pang-Hup; Swee, Yong-Khim; Chan, Min-Yu; Low, Siu-Waf; Toh, J.; Chan, J.; Leong, Chew-Weng

doi:10.1109/ectc.1997.606192

1997 Proceedings 47th Electronic Components and Technology Conference

DOI: 10.1109/ectc.1997.606192

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Board on chip-ball grid array (BOC-BGA/sup TM/) package. A new design for high frequency application (package design and reliability)

Chee-Kiang Yew

Pang-Hup Ong

Yong-Khim Swee

et al.

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Board on chip-ball grid array (BOC-BGA/sup TM/) package. A new design for high frequency application (package design and reliability)

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