Board level reliability assessments of package on package

Hwang, Tae Kyung; Sohn, Eun Sook; Kang, Won Joon; Cha, Se Woong; Lee, Joon Yeob; Hwang, Chan Ha; Lee, Choon Heung

doi:10.1109/emap.2007.4510333

Cited by 4 publications

(2 citation statements)

References 4 publications

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“…It can be seen that solder joints of conventional PCB without underfill failed within the first 500 cycles while conventional PCB with underfill did not show any failure even after 1000 cycles. As expected, the solder joints failure of conventioanal PCB without underfill occurred due to the huge CTE mismatch between the Si die and the bard and underfill material provides stress relief in solder joint of conventional PCB by redistribution of the stresses induced CTE mismatch [8]. During TC test, however, the solder joints of low CTE PCB without underfill were shown better performance than conventional PCB and also reliability of low CTE PCB with underfill was good.…”

Section: Resultssupporting

confidence: 52%

Board Level Reliability of Solder Joint with a Low CTE PCB

et al. 2012

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With increasing market demands of electric products for smaller, thinner, and faster, printed circuit board (PCB) are pushed to accommodate these requirements. A PCB with low CTE and high elastic modulus could be an alternative to be able to meet the requirements needed for the next generation of high-performance microsystems. In this study, the board level reliability test was performed to evaluate solder joint reliability of low CTE PCB and conventional PCB. Solder joint could be generated the failure due to stresses induced by large coefficient of thermal expansion (CTE) mismatch between silicon and printed circuit board (PCB) under temperature variation. Also, in daily use portable devices such as cellular phones, PDAs, and MP3 players, it is common for them to be subjected to accidental drop impacts resulting in damage and hence failures. Therefore, the reliability performance of solder joints during temperature cycling and drop test is a key issue and it was focused to obtain the board level reliability of solder joint on low CTE PCB. After board level reliability test, cross-section SEM and OM was done to analyze fracture modes of solder joint reliability.

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Section: Resultssupporting

confidence: 52%

Board Level Reliability of Solder Joint with a Low CTE PCB

et al. 2012

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“…Presently, FEM simulation related to ACF is simply linear analysis. For example, warpage analysis, particle deformation analysis, linear thermal fatigue analysis, etc [3,4] In this research, thermal fatigue analysis process of ACF bonding flip-chip packaging was studied considering nonlinear characteristic of ACF.…”

Section: Introductionmentioning

confidence: 99%

Thermal Fatigue Life Prediction of ACF Bonding Flip Chip Packaging

Nam

2006

KEM

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The use of flip-chip technology has many advantages over other approaches for high-density electronic packaging. ACF (anisotropic conductive film) is one of the major flip-chip technologies, which has short chip-to-chip interconnection length, high productivity, and miniaturization of package. In this study, thermal fatigue life of ACF bonding flip-chip package has been predicted. Elastic and thermal properties of ACF were measured by using DMA and TMA. Temperature dependent nonlinear bi-thermal analysis was conducted and the result was compared with Moire interferometer result to verify FEM results. Calculated displacement field was well matched with experimental result. Thermal fatigue analysis was also conducted. The maximum shear strain occurs at the outmost located bump. Shear stress-strain curve was obtained to calculate fatigue life. Fatigue model for electronic adhesives was used to predict thermal fatigue life of ACF bonding flip-chip packaging. Approximately, 700 cycles have been expected under current conditions (JEDEC standard No. 22-A104)

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Comparative studies on solder joint reliability of CTBGA assemblies with various adhesives using the array-based package shear test

Shi

Ueda

2011

Microelectronics Reliability

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Board level reliability assessments of package on package

Cited by 4 publications

References 4 publications

Board Level Reliability of Solder Joint with a Low CTE PCB

Board Level Reliability of Solder Joint with a Low CTE PCB

Thermal Fatigue Life Prediction of ACF Bonding Flip Chip Packaging

Comparative studies on solder joint reliability of CTBGA assemblies with various adhesives using the array-based package shear test

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