2023
DOI: 10.1088/1361-6528/acfe16
|View full text |Cite
|
Sign up to set email alerts
|

Black silicon spacing effect on bactericidal efficacy against gram-positive bacteria

Md Imrul Kayes,
Mehdi Zarei,
Fanbo Feng
et al.

Abstract: The morphology of regular and uniform arrays of black silicon structures were evaluated for bactericidal efficacy 
against gram-positive, nonmotile \textit{Staphylococcus~epidermidis} (\textit{S.~epidermidis}). 
In this study, uniform and regular arrays of black silicon structures were fabricated using nanosphere lithography. A systematic evaluation of nanomorphology effects on bacterial killing were studied with 300 to 1400 nm pitch 
silicon nanostructures
on spherical cocci o… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1
1

Citation Types

0
6
0

Year Published

2024
2024
2024
2024

Publication Types

Select...
5

Relationship

2
3

Authors

Journals

citations
Cited by 6 publications
(6 citation statements)
references
References 58 publications
0
6
0
Order By: Relevance
“…We transferred the self-forming cracks to the PET using RIE with a gas flow of 50 sccm CF 4 and 20 sccm SF 6 , a pressure of 30 mT, and a power of 250 W. RIE is well-suited for etching high-aspect-ratio anisotropic structures, such as deep trenches or narrow channels. This capability is essential for creating complex patterns with varying depths. , RIE provides control over the etch rate, resulting in varying trench thicknesses. , However, it is important to note that the crack template layer is also susceptible to etching. This imposes a limitation on the maximum etching time and, consequently, the achievable depth of the trenches.…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…We transferred the self-forming cracks to the PET using RIE with a gas flow of 50 sccm CF 4 and 20 sccm SF 6 , a pressure of 30 mT, and a power of 250 W. RIE is well-suited for etching high-aspect-ratio anisotropic structures, such as deep trenches or narrow channels. This capability is essential for creating complex patterns with varying depths. , RIE provides control over the etch rate, resulting in varying trench thicknesses. , However, it is important to note that the crack template layer is also susceptible to etching. This imposes a limitation on the maximum etching time and, consequently, the achievable depth of the trenches.…”
Section: Resultsmentioning
confidence: 99%
“…This capability is essential for creating complex patterns with varying depths. 42 , 75 RIE provides control over the etch rate, resulting in varying trench thicknesses. 42 , 43 However, it is important to note that the crack template layer is also susceptible to etching.…”
Section: Resultsmentioning
confidence: 99%
“…34–37 It is noteworthy that these nanocone structures could be fabricated by maskless reactive ion etching 5,6,38 or nanosphere lithography combined with etching. 39 However, designing nanocone structures introduce the need to optimize over many parameters, necessitating a large number of structure evaluations.…”
Section: Preliminariesmentioning
confidence: 99%
“…These findings diverge from the expected pattern of nanopillar spacing's influence on bactericidal properties and contradict prior literatures. 30,31 3.3. Local Elastic Modulus to Bactericidal Performance.…”
Section: Bacterial Viabilitymentioning
confidence: 99%