2022
DOI: 10.1021/acs.iecr.2c01281
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Biomimetic Nacreous Composite Films toward Multipurpose Application Structured by Aramid Nanofibers and Edge-Hydroxylated Boron Nitride Nanosheets

Abstract: High-performance dielectric film is one of the most promising materials for comprehensive applications ranging from high-voltage electrical equipment to high-power electronic devices. We here report the fabrication of biomimetic nacreous multifunctional composite films by self-assembling nanoscale building blocks of one-dimensional (1D) aramid nanofibers (ANFs) and two-dimensional (2D) edge-hydroxylated boron nitride nanosheets (BNNS-OH). Synchronously, poly(vinyl alcohol) was introduced as soft glue to improv… Show more

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Cited by 25 publications
(8 citation statements)
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“…The growth of electrical branches inside the composite film is required to circumvent the BNNS. The higher loading capacity of the film offered a longer and more tortuous path for the propagation of electric branches . The E 0 values of the BNNS@Ag/PDMS composite films increased with the amount of BNNS@Ag ranging from 5 to 20 wt %.…”
Section: Results and Discussionmentioning
confidence: 99%
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“…The growth of electrical branches inside the composite film is required to circumvent the BNNS. The higher loading capacity of the film offered a longer and more tortuous path for the propagation of electric branches . The E 0 values of the BNNS@Ag/PDMS composite films increased with the amount of BNNS@Ag ranging from 5 to 20 wt %.…”
Section: Results and Discussionmentioning
confidence: 99%
“…The higher loading capacity of the film offered a longer and more tortuous path for the propagation of electric branches. 62 The E 0 values of the BNNS@Ag/PDMS composite films increased with the amount of BNNS@Ag ranging from 5 to 20 wt %. A maximum E b was obtained at 20 wt % (130.61 kV/mm), an increment of 15.1% over the E 0 of the pure PDMS film (113.52 kV/mm).…”
Section: Tce (mentioning
confidence: 94%
“…High-performance heat dissipation has become a substantive need for developing the miniaturization and densification of electronic devices to solve “hot spot” problems because the generated heat accumulation poses a threat to the function and reliability of electronic components. To quickly remove excess heat from the confined space of electronic devices, it is highly required to enhance the heat dissipation along a specific direction. …”
Section: Introductionmentioning
confidence: 99%
“…One is dispersing high–ε r inorganic fillers into an insulating polymer [ 18 ], such as Pb(Zr 1−x Ti x )O 3 (PZT), BaSrTiO 3 , and others. Generally speaking, a decent increase in ε r can be observed in the composites only when the filler concentration is nearly close to 65 wt% [ 19 , 20 , 21 , 22 ], which will inevitably destroy the processing [ 23 , 24 , 25 , 26 , 27 , 28 ], optical and mechanical performances of the composites [ 29 ]. Another approach to solve this question is based on percolating composites by using the conductive particles, such as copper (Cu) [ 23 ], zinc (Zn) [ 24 ], iron (Fe) [ 25 ], silver (Ag) [ 26 ] and carbon materials such as nanotubes (CNTs) [ 27 ].…”
Section: Introductionmentioning
confidence: 99%