2018 IEEE 30th International Symposium on Power Semiconductor Devices and ICs (ISPSD) 2018
DOI: 10.1109/ispsd.2018.8393611
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Bidirectional threshold voltage shift and gate leakage in 650 V p-GaN AlGaN/GaN HEMTs: The role of electron-trapping and hole-injection

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Cited by 35 publications
(14 citation statements)
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“…Commercially available GaN HEMTs have been the subject of different studies including electrothermal characterization [5][6][7]and reliability studies (summarized in [8]), with a JEDEC committee (JC-70) focused on the development of standards for GaN power devices [9,10]. The reliability studies include power cycling [11][12][13], dynamic ON-state resistance [14][15][16] and threshold voltage (VTH) instability [17][18][19][20][21][22][23], which is the focus of the investigations presented in this paper.…”
Section: Introductionmentioning
confidence: 99%
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“…Commercially available GaN HEMTs have been the subject of different studies including electrothermal characterization [5][6][7]and reliability studies (summarized in [8]), with a JEDEC committee (JC-70) focused on the development of standards for GaN power devices [9,10]. The reliability studies include power cycling [11][12][13], dynamic ON-state resistance [14][15][16] and threshold voltage (VTH) instability [17][18][19][20][21][22][23], which is the focus of the investigations presented in this paper.…”
Section: Introductionmentioning
confidence: 99%
“…The previous studies [17][18][19][20][21][22][23] highlight the complexity of the gate stack structure and different threshold voltage shifts depending on the magnitude of the gate stress voltage. For example, in Schottky gate GaN devices, positive VTH drift at low gate voltage VGS bias has been reported due to electron trapping in acceptor like states at the AlGaN/GaN interface [21,24]. For Schottky gate GaN HEMTs, electron trapping at the interface yields a net negative charge in the p-GaN layer thereby resulting in a positive VTH shift since more voltage is required to create the 2DEG.…”
Section: Introductionmentioning
confidence: 99%
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“…1) Injection of electrons from the 2DEG into the AlGaN barrier where they get trapped causing a positive V T shift [136]. This process exhibits weak thermal activation (E a = 0.17 eV in [135], reflecting the location of the traps in the AlGaN with respect to the GaN conduction band edge), and it is recoverable [137].…”
Section: E Interface State Formation In Gan Mis-hemtsmentioning
confidence: 99%
“…In recent years, the p-GaN gate related reliability issues are attracting more research interest and many studies have been performed on this topic. Among these reliability issues, the device performances such as the threshold voltage (VTH) shift [4]- [10] and leakage current increase [11], [12] have attracted the most attention. The p-GaN/AlGaN/GaN heterostructure is a direct-bandgap hetero-PIN junction, in which the electron and hole injection processes are normal.…”
Section: Introductionmentioning
confidence: 99%